Features * Pressure ranges from 10 mbar to 5 bar absolute, differential or gage * Barometric pressure ranges * Output: I²C bus and 0.5...4.5 V * Precision ASIC conditioning * Calibrated and temperature compensated * Miniature SMT and DIP housings * Sensortechnics PRO services Applications * Medical equipment * Environmental controls * HVAC General description First Sensor HDI sensors offer precision pressure measurement from 10 mbar up to 5 bar. The HDI series performs precision digital signal conditioning to achieve ultra high total accuracies. An internal ASIC compensates sensor offset, temperature effects and non-linearity to allow for an excellent Total Error Band (TEB) better than ±0.5 %FSS. The pressure sensors provide digital interfaces with I²C bus protocol as well as analog output signals. Optional 3 V supply voltage versions and special low power devices make the HDI series ideal for battery powered applications, e.g. in portable or handheld devices. Miniature SMT housings allow for space-saving PCB-mounting and maximum OEM design flexibility. Size without nipples and pins (approx.) 12 x 15 x 7 mm
General specification for hdi pcb Layer count: 4-20layers Type of stack up: 1+n+1, 2+n+2 Material available: fr4, high tg fr4, halogen free fr4 Board thickness: 0.4-3.2mm Finished copper thickness: 1/3oz ¡§c 3oz Min trace width/spacing: 3/3mil Min through hole: 0.2mm Min blind via: 0.1mm Surface treatment: immersion gold, enig + osp Vacuum package
Material: fr4 Setup: 3 + 4 + 3 Finishing thickness: 1.0 ¡¨¤0.1mm Minimum width/spacing: 0.10/0.10mm Minimum laser via: 0.1mm Surface finishing: enig + osp Specialty: blind and buried via Application field: communication
Multilayer and 2rd HDI PCB 35
What is HDI PCB High density interconnect (HDI) PCB, represent one of the fastest growing technologies in PCBs. Because of its higher circuitry density than traditional circuit boards, the HDI PCB design is able to incorporate smaller vias and capture pads, and higher connection pad densities. HDI Boards contain blind and buried vias and often contain micro vias of 0.006 or less in diameter. By using HDI technology, designers now have the ability to place more components on both sides of the raw PCB if desired. Now as the development of via in pad and blind via technology, it allow designers to place smaller components closer together. This means faster transmission of signals and a significant reduction in signal loss and crossing delays. HDI PCB is regularly found in mobile phones, touch-screen devices, laptop computers, digital cameras, 4G network communications, also prominently featured in medical devices. Advantages of HDI PCB The most common reason for using HDI technology is a significant increase in packaging density. The space that obtained by finer track structures is available for components. In addition, overall space requirements are reduced will result in smaller board sizes and fewer layers. Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.
HDI Wholesale PCB Board, HDI PCB Board, Single-Side, Double-Side PCB, PCB Process, High Frequency Board, Customized PCB Product Type: HDI Application Field: Industril Control, Medical, Communication Layer/Board thickness: 10L/1.1mm Suface Finish: ENIG Trace/Space: 3/3mil Smallest Hole Diameter: 0.1MM Technical Feature: Three Orders Overlap Hole, Tiny Line, Micro Vias As a PCB board supplier, we can OEM PCB including HDI PCB board, single-side PCB, double-side PCB, PCB process, high frequency board.
Hdi pcb, 18layers, board thinkness 2.4mm, gold-plating-50uâ??, high frequency, O-leading supply chain (hk) co., limited strives to be your one stop solution partner of ems manufacture, including pcb design , pcb fabrication and pcb assembly (pcba).We providing some of the most advanced pcb technology and convenient services applied in the industry: hdi pcbs, super long pcbs, rigid-flex pcbs, quick turn pcbs, medium & mass production, full turn-key assemblies , in general, our global customers have following impressions of our services: quick response, reasonable price level, top customer perspective, quality commitment.
Blind/Buried Via 5+N(N+M)+5 Structure Trace Width/Spacing 1.6/1.6mil Laser Hole Size(mm) 0.075 High Density Interconnector Founded in 2007, PEAK Co.,Ltd is an electronic solutions company offering 1-64 layers PCB fabrication, assembly, testing & validation of rigid, rigid-flex, HDI, high frequency, high speed, metal core, IC substrate, substrate-like and other special PCB. Our modern 54,000 square foot manufacturing facility allows us to provide all rigid & rigid-flex services under one roof and offer quick-turn capabilities.PEAK has a professional reputation for developing high-performance solutions for technically advanced OEM's in a variety of markets including aerospace and defense, medical, computer, communication, server, semiconductor IC, automotives, industrial control, optoelectronics, LED and others.
1+N+1 ~ Anylayer Capa 40layer. Can do any surface treatment.
HDI boards, one of the fastest growing technologies in PCBs, are now available at Eolane SCM. HDI interconnect board contains blind and/or buried vias and often contains microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards. There are 6 different types of HDI high density interconnect pcb boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias, passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs. HDI any-layer printed circuit boards are the next technological enhancement of HDI microvia printed circuit boards: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is that all the layers can be freely interconnected. To produce these circuit boards, RayMing uses laser-drilled microvias electroplated with copper. Special technologies used with HDI any-layer printed circuit boards: �Edge plating for shielding and ground connection �Minimum track width and spacing in mass production around 40μm �Stacked microvias (plated copper or filled with conductive paste) �Cavities, countersunk holes or depth milling �Solder resist in black, blue, green, etc. �Low-halogen material in standard and high Tg range �Low-DK Material for Mobile Devices �All recognised printed circuit board industry surfaces available HDI PCBs capitalize on the latest technologies available to increase the functionality of PCBs using the same or less amount of area. This advancement in PCB technology is driven by the miniaturization of components and semiconductor packages that supports advanced features in revolutionary new products. This includes touch screen computing, 4G network communications and military applications such as avionics and smart munitions. HDI PCBs capitalize on the latest technologies available to increase the functionality of PCBs using the same or less amount of area. This advancement in PCB technology is driven by the miniaturization of components and semiconductor packages that supports advanced features in revolutionary new products. This includes touch screen computing, 4G network communications and military applications such as avionics and smart munitions. HDI PCBs are characterized by high-density attributes including laser microvias, fine lines and high performance thin materials. This increased density enables more functions per unit area. Higher technology HDI PCBs have multiple layers of copper filled stacked microvias (Advanced HDI PCBs) which creates a structure that enables even more complex interconnections. These very complex structures provide the necessary routing solutions for today's large pin-count chips utilized in mobile devices and other high technology products.
Place of origin: taiwan Base material: varied Copper thickness: 0.45 mils - 14 mils Annular ring: 1.5 mils Inner line width:
Jinsung Electronics company produces High-end Rigid-Flex PCB which is used for multiple product groups such as smartphones, camera module, electric apparatuses, medical devices, defense articles, and so on supplying to domestic and global market 1. LAYER : 6 Layer (FLEXIBLE 2 layer+RIGID 4 layer) 6-2-6 2. Application : Inspection equipment of Semiconductor 3. Thickness : 0.5T 4. Structure : 1-2LBVH ,2-3L BVH 1-4 STACK BVH , 4-6BVH , 56BVH 5. Machine Drill : Min. 0.25mm 6. Cu Plating : VIA FILL + PTH 7. BGA(LAND/PTICH) : 0.3 mm / 0.4pitch
HDI Board HDI PCB Specification layer Count 12L Material ISOLA Board Thickness 2.4±0.1mm Stack-up 4+N +4 Aspect Ratio 12:1, 8mils Hole to Copper Blind vias L1L4 , L8L12 Micro-vias L1L2 , L11L12 Via-in-Pad Min. LW/LS 0.075mm Surface Finish ENIG We have over 17 years experience of HDI PCB baord production, and provide high quality HDI board to customers is our long term strategy, Any HDI Board projects need production please contact us freely
Special futures Thickness: 1.6mm Application: projector or projecting apparatus Minimum trace size: 0.1mm Minimum drill: 0.15mm With blind and buried holes Layers: 1 to 28 Board finished thicknesses: 0.2 to 7.0mm Materials: FR-4, CEM-3, high Tg, halogen-free FR4 and Rogers,F4B Maximum finished board size: 580 x 900mm Minimum hole size: 4mil (0.1mm) Minimum trace width/space: 3.5/3.5mil Surface finishes/treatments: HASL, lead-free HASL, immersion gold, gold plating, immersion silver, immersion tin and OSP Copper thicknesses: 0.5 to 6oz Solder mask colors: green, yellow, black, white, red and blue Copper thickness in hole: >18um Inner packaging: plastic bag (vacuum packing) Outline tolerance: ¡À0.13mm Hole size tolerance: (PTH) ¡À0.076 and (NPTH) ¡À0.05mm With UL and TS16949:2002 marks Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger Profiling: punching, routing, V-cut and beveling OEM services to all sorts of printed circuit board assembly as well as electronic encased products are provided. Inner:vacuum packaging. Outer:carton.
LAYER - 6Layer (FLEXIBLE 2layer+RIGID 4layer) 6-2-6 Application Inspection equipment of Semiconductor Thickness - 0.5T Structure - 1-2LBVH ,2-3L BVH 1-4 STACK BVH , 4-6BVH , 56BVH Machine Drill Min. 0.25mm Cu Plating VIA FILL + PTH BGA(LAND/PITCH) - 0.3mm / 0.4pitch PSR GREEN Surface treatment ENIG
Hdi pcb printed circuit board, china pcb manufacture Layer count: 18l Materials: m6 Board thickness: 3.0+/-0.3mm Finishing size: 210x395.2mm Min line w/s: 3.2/3.5mil Min drill size [fhs/dhs] : 0.20mm/0.30mm Plating ar dhs : 11.7:1 Hard gold thickness: 4um Surface finish: enig Impedance: tol: +/-7%, the deviation of the impedance in the same layer must not exceed +/- 2ohm Other : back drill, rotated 7 degree. Good day, hope you are well. This is betty from o-leading supply chain (hk) co., limited, we strives to be your one stop solution partner of ems from china, including pcb design , pcb fabrication and pcb assembly (pcba), electronic components and so on. The services we offer are beyond your imagination Quick turn prototypes(24 or 48 hours), medium to high volumes 1-32 layers(rigid, flex, rigid-flex, hdi ) pcb Fr4, high tg, rogers, arlon, metal base, halogen free Heavy copper to 12oz 1.5m super long pcb Full turn-key pcb assembly Advantages: 1. Competitive price 2.Stable quality 3.Oem & punctual & fast delivery If any questions or pcb projects, please feel free to contact us, looking forward to establishing cooperation with you in near future. Best regards, Betty kuang O-leading supply chain (hk) co., limited
Dear Friends, Our company specializes in producing High Mix & Medium-small series Rigid PCBs(1-28layers),Rigid-flex pcbs as well as AL pcbs in China . As a Sales Manager in my company, I have worked in PCB industry over than 10year since my graduation from University . We exported a lot of PCBs to Europe and America countries for several years . I expect to know more parnters all over the world through here.
Brand Name: strongtimes Number of Layers: 4 Base Material: FR-4 Copper Thickness: 3mil Board Thickness: 1.6mm Min. Hole Size: 4mil Min. Line Width: 3mil Min. Line Spacing: 3mil Surface Finishing: lead free hal Printed Circuit board, Single Side PCB, Double Side PCB, Multilayer PCB, Rigid Flexible PCB, Rigid PCB, Flexible PCB, Impedance PCB, HDI PCB, MCPCB, FPC, Aluminum PCB, PCB, PCBA StrongTimes Electronics Co., Ltd is a high and new technological company which specializing in manufacturing single-sided, double-sided and multilayer PCB of high precision, high density and high reliability.
Layer count: 10 layer Board thickness 0.80mm Raw material FR4 370HR Min.line width/space 0.075/0.075mm Minimum hole diameter 0.10mm Surface finishing ENIG Plug via-in-pad by resin and plate flat
Layers3 36 Layers HDI Step 3+N+3 Min.Line Width0.05mm (2 mil) Min.Line Space0.05mm (2 mil) Min.Annular ring0.1mm (4 mil) Min. Via0.1mm (4 mil) Max.Size500mm X 800mm MaterialFR4,High Tg220 Material thickness Start at 25um Plus copper Copper thickness0.3 OZ to 10 OZ (10um 350um) Please contact us for more information about HDI PCB Board.