Layers3 36 Layers
HDI Step 3+N+3
Min.Line Width0.05mm (2 mil)
Min.Line Space0.05mm (2 mil)
Min.Annular ring0.1mm (4 mil)
Min. Via0.1mm (4 mil)
Max.Size500mm X 800mm
MaterialFR4,High Tg220
Material thickness Start at 25um Plus copper
Copper thickness0.3 OZ to 10 OZ (10um 350um)
Please contact us for more information about HDI PCB Board.
We just processed in a large batch of chipsets. I posted below current inventory and attached pictures of each type of chipset. Please review and let me know your interest/offer. Chipset 1 (H61) â?? 3,350 units Chipset 2 (H81) â?? 2,206 units Chipset 3 (H55) â?? 436 units Chipset 4 (B250) â?? 1,600 units Chipset 5 (SR406) â?? 345 units Thank you, Divanti Group
we are leading manufacturer & exporter of standoff/spacers as per requirement or Drawing
Layer count: 10 layer Board thickness 0.80mm Raw material FR4 370HR Min.line width/space 0.075/0.075mm Minimum hole diameter 0.10mm Surface finishing ENIG Plug via-in-pad by resin and plate flat
Supplier: Ndfeb magnet, magnetic assembly, ferrite magnets, smco, halbach array magnet, surge protection device, gas discharge tube, lightning protection earthing system, spd, gdt, arrester, surge, lightning
Supplier: Consumer electronics, industrial control, and high speed connectivity cables and connectors.
Services: Manufacturer, designing, customization for consumer electronics, industrial control, and high speed connectivity cables and connectors.
Buyer: Consumer electronics, industrial control, and high speed connectivity cables and connectors.
Supplier: Medical cable, extrusion, cable, wire, connector, cable assembly, wire harness, pvc, hdpe, pp, ldpe, pcb, pcba, injection mold, injection molding, fixture, machining part, stamping part, tube, catheter, wire harness, release paper, release liner, flim, tape, silicone foam, sponge
Services: Export and shipping
ON SEMI, FCM8202QY, the year 2021 qty 2500 pcs
Special futures Thickness: 1.6mm Application: projector or projecting apparatus Minimum trace size: 0.1mm Minimum drill: 0.15mm With blind and buried holes Layers: 1 to 28 Board finished thicknesses: 0.2 to 7.0mm Materials: FR-4, CEM-3, high Tg, halogen-free FR4 and Rogers,F4B Maximum finished board size: 580 x 900mm Minimum hole size: 4mil (0.1mm) Minimum trace width/space: 3.5/3.5mil Surface finishes/treatments: HASL, lead-free HASL, immersion gold, gold plating, immersion silver, immersion tin and OSP Copper thicknesses: 0.5 to 6oz Solder mask colors: green, yellow, black, white, red and blue Copper thickness in hole: >18um Inner packaging: plastic bag (vacuum packing) Outline tolerance: ¡À0.13mm Hole size tolerance: (PTH) ¡À0.076 and (NPTH) ¡À0.05mm With UL and TS16949:2002 marks Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger Profiling: punching, routing, V-cut and beveling OEM services to all sorts of printed circuit board assembly as well as electronic encased products are provided. Inner:vacuum packaging. Outer:carton.
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