Layer count: 10 layer
Board thickness 0.80mm
Raw material FR4 370HR
Min.line width/space 0.075/0.075mm
Minimum hole diameter 0.10mm
Surface finishing ENIG
Plug via-in-pad by resin and plate flat
We just processed in a large batch of chipsets. I posted below current inventory and attached pictures of each type of chipset. Please review and let me know your interest/offer. Chipset 1 (H61) â?? 3,350 units Chipset 2 (H81) â?? 2,206 units Chipset 3 (H55) â?? 436 units Chipset 4 (B250) â?? 1,600 units Chipset 5 (SR406) â?? 345 units Thank you, Divanti Group
Layers3 36 Layers HDI Step 3+N+3 Min.Line Width0.05mm (2 mil) Min.Line Space0.05mm (2 mil) Min.Annular ring0.1mm (4 mil) Min. Via0.1mm (4 mil) Max.Size500mm X 800mm MaterialFR4,High Tg220 Material thickness Start at 25um Plus copper Copper thickness0.3 OZ to 10 OZ (10um 350um) Please contact us for more information about HDI PCB Board.
Supplier: Medical cable, ce cable, wire, connector, cable assembly, cable harness, pvc, hdpe, pp, ldpe, pcb, pcba, injection mold, injection molding, fixture, machining part, stamping part, tube, catheter, wire harness
Services: Export and shipping
Supplier: 1. lighting products:
indoor luminaires: led bulb, led tube, led panel, led slim panel, led batten, led ceiling, led cross light, linear light, led high bay, led parking, led downlight, led track light.
outdoor luminaires: led flood light, led solar flood light, led street light, led solar street light.
led grow lights: a variety of professional grow lights for many kinds of plants such as dragon fruit, chrysanthemum, medicinal plants, ginseng, tomatoes, strawberries, grapes, watermelons, cantaloupe, bell peppers, orchids, vegetables, algae, etc.
fishing lights: on boat lights and underwater lights.
2. kitchenware products:
vacuum flask (glass inner or double wall stainless steel layers)
water bottle
electric kettle
electric blender
rice cooker
glass liner and accessories.
Services: Manufacturing, export and import, transport, and odm/oem services for all of the products.
Special futures Thickness: 1.6mm Application: projector or projecting apparatus Minimum trace size: 0.1mm Minimum drill: 0.15mm With blind and buried holes Layers: 1 to 28 Board finished thicknesses: 0.2 to 7.0mm Materials: FR-4, CEM-3, high Tg, halogen-free FR4 and Rogers,F4B Maximum finished board size: 580 x 900mm Minimum hole size: 4mil (0.1mm) Minimum trace width/space: 3.5/3.5mil Surface finishes/treatments: HASL, lead-free HASL, immersion gold, gold plating, immersion silver, immersion tin and OSP Copper thicknesses: 0.5 to 6oz Solder mask colors: green, yellow, black, white, red and blue Copper thickness in hole: >18um Inner packaging: plastic bag (vacuum packing) Outline tolerance: ¡À0.13mm Hole size tolerance: (PTH) ¡À0.076 and (NPTH) ¡À0.05mm With UL and TS16949:2002 marks Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger Profiling: punching, routing, V-cut and beveling OEM services to all sorts of printed circuit board assembly as well as electronic encased products are provided. Inner:vacuum packaging. Outer:carton.
Supplier: Electrnic components, cable assembly, pcb
General specification for hdi pcb Layer count: 4-20layers Type of stack up: 1+n+1, 2+n+2 Material available: fr4, high tg fr4, halogen free fr4 Board thickness: 0.4-3.2mm Finished copper thickness: 1/3oz ¡§c 3oz Min trace width/spacing: 3/3mil Min through hole: 0.2mm Min blind via: 0.1mm Surface treatment: immersion gold, enig + osp Vacuum package
Material: fr4 Setup: 3 + 4 + 3 Finishing thickness: 1.0 ¡¨¤0.1mm Minimum width/spacing: 0.10/0.10mm Minimum laser via: 0.1mm Surface finishing: enig + osp Specialty: blind and buried via Application field: communication