Ansan-si,
Gyeonggi-do,
South Korea (Republic Of Korea)
LAYER - 6Layer (FLEXIBLE 2layer+RIGID 4layer) 6-2-6
Application Inspection equipment of Semiconductor
Thickness - 0.5T
Structure - 1-2LBVH ,2-3L BVH 1-4 STACK BVH , 4-6BVH , 56BVH
Machine Drill Min. 0.25mm
Cu Plating VIA FILL + PTH
BGA(LAND/PITCH) - 0.3mm / 0.4pitch
PSR GREEN
Surface treatment ENIG
Please ask detailed and specific
questions about Pricing, Minimum Order Quantity, Delivery Timelines etc. Detailed Messages
result in prompt responses.
