SECrosslink-6261 high thermal conductivity, high electrical conductivity, low ion content, single component, high temperature resistance, shock resistance, used for chip bonding.
Brand SECrosslink Type SECrosslink-6261
Curing condition 200 /40 min ECA types Nano-silver
Silver content 92% Viscosity 32000CPS
Thermal conductivity 150 w/mK Shearing strength 35MPa
Silver content 91% Application Die attach
Appearance Silver gray Usage temperature -30 - 400
SECrosslink-6260 high thermal conductivity, high electrical conductivity, low ion content, single component, high temperature resistance, high Tg, high hardness, used for standard LED devices.
Brand SECrosslink Type SECrosslink-6260
Curing temperature 150 /1 h Resin types Epoxy
Thermal conductivity 5 w/mK Tg 220
Feature high thermal conductivity, high electrical conductivity, low ion content, single component, high temperature resistance, high Tg, high hardness, used for standard LED devices Content of effective elements 90%
Appearance Silver gray Usage temperature -30 - 260
Silver content 89% Viscosity 40000CPS
Shearing strength 25MPa Storage T -10 - 0
SECrosslink-6061 is two-component, conductive adhesive cured at room temperature, high conductivity, high temperature resistance, impact resistance, high bonding strength, no solvent, etc.
SECrosslink-6160 low temperature fast curing weldable conductive silver paste, single component, high Tg, high temperature resistance, good weldability - pass the weldability and weldability test, excellent contact resistance, high adhesion, suitable for screen printing process.
Brand SECrosslink Type SECrosslink-6160
Curing method Heat curing 100 Adhesive types Epoxy
Silver content 91% Viscosity 40000CPS
Feature Low temperature quick curing, weldable conductive adhesive, strong welding tension Application Glass electrode, ceramic thermal resistance
Content of effective elements 99.6% Welding tension >1MPa (Vertical tensile strength)
Welding temperature 275- 300 Weldability good
