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Low-T Quick Curing Conductive Silver Paste

$4 - $5
MOQ: Not Specified
Mention destination port, expected quantity and required specifications in your inquiry.

Key Specifications

Price$4 - $5
MOQNot Specified

Product Description

SECrosslink-6062 low-temperature rapid curing, single component, high silver content, low volume resistivity, good adhesion to glass, ceramics, silicon wafers, flexible polymer materials, suitable for screen printing process.
Brand SECrosslink Type SECrosslink-6062
Curing temperature 100 Content 75%
Content of effective elements 90% Volume resistivity 0.00009©cm
Appearance Silver gray Shelf life 12 months
Product grade Excellent Storage method -10-0

Full Specifications

Product NameLow-T Quick Curing Conductive Silver Paste
Seller CodeSecrosslink-6062
Price$4 - $5
Minimum OrderNot Specified

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Member Details
Juhe (Shanghai) Advanced Materials Technology Co., Ltd.
Shanghai
Shanghai China
Contact Person: Jackson
Phone: Not displayed by user.
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Frequently Asked Questions

What product is offered by Juhe (Shanghai) Advanced Materials Technology Co., Ltd.?

Juhe (Shanghai) Advanced Materials Technology Co., Ltd. offers Low-t Quick Curing Conductive Silver Paste. The supplier is from China.

Where is the supplier of Low-t Quick Curing Conductive Silver Paste located?

The supplier of Low-t Quick Curing Conductive Silver Paste, Juhe (Shanghai) Advanced Materials Technology Co., Ltd., is located in Shanghai, Shanghai, China.

What is the price for Low-t Quick Curing Conductive Silver Paste?

The price for Low-t Quick Curing Conductive Silver Paste is $4 - $5. Final pricing may depend on quantity, specifications, order size, and buyer requirements.

What products does Juhe (Shanghai) Advanced Materials Technology Co., Ltd. deal in?

Juhe (Shanghai) Advanced Materials Technology Co., Ltd. deals in electronic semiconductor industry, silver conductive paste for screen touch screen, conductive paste for rifd, led die attach conductive adhesive, uv curing conductive adhesive, conductive coating for electromagnetic interference, conductive paste for photovoltaic solar, conductive ink for lithium ion battery anode, interfacial thermal conductive materials, optical communication adhesive, special adhesive, and nanometer materials and functional coatings.