For wafer scribing and dicing, you need the sharp edge of the UV laser
Wafer is the basic material used to manufacture IC. It is made into long silicon ingots after purification of silicon elements. When making integrated circuits, semiconductor materials should be used to melt polysilicon out of monocrystalline silicon ingots through multiple procedures, and then cut to produce Made. As an electronic component, it is used in many electronic products. The wafer area is usually small, so there is a high precision requirement in cutting and scribing.
Return visit UV laser scribing on the wafer, what's the customer's comment
has recently welcomed a number of return visits from . Among them, has been ordering cooperation with for five years. He is the first batch of manufacturers to use UV lasers for wafer scribing. At that time, UV lasers were not widely used, and after tried to scribe the wafer surface, immediately chose to visit and witness the possibility of wafer scribing.
Standing in the wave of laser technology, UV lasers win customers hearts with their strengths
For him, the traditional process of scribing the wafer surface has insufficient precision, slow speed, and many consumables that have plagued him for a long time. During the visit of , he witnessed the spot emitted by the UV laser continuously moving on the tiny wafer. It only took more than ten seconds to complete the complex scribing, and it was able to automatically complete the scribing without the involvement of employees. conduct.
24 hours of stable continuous operation and super long life can also satisfy the assembly line of
Moreover, in addition to the non contact processing of the material during operation, it only needs to be plugged in and no other auxiliary materials are needed to be lost, which greatly reduces the cost and waste. The 24 hour stable continuous operation and ultra-high life span can also satisfy the assembly line of Therefore, chose the ultraviolet laser at the beginning and has used it until now.
Nanosecond UV Laser
Every time there is a breakthrough in the research and development of UV lasers, understanding and congratulations. like many other customers, stands in the wave of laser technology, progresses and learns together with , and establishes a revolutionary friendship. Develop in different fields.
The UV laser marking machine is developed by using a 355nm UV laser. This machine uses a third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355nm UV laser has a very small spot, and the marking effect is directly interrupted by a short-wavelength laser. The molecular chain greatly reduces the mechanical deformation of the material. Thermal deformation (cold light), because it is mainly used for ultra-fine marking and engraving. It is especially suitable for applications such as marking, micro-hole drilling of food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.
Naturel and Roasted Diced Hazelnuts. Hazelnult Kernels cut into smaller pieces with 0.8-3% desired humidity level and 5-30% skin.
Usage : Bakery, chocolate, ice cream,biscuits, wafers
Size: Any size between 0-12 mm.
Packaging: 10, 25 kg vacuum bags in cartons.
1.Introduction
The new generation of laser scribing machine YMS-50 (CE certificated product) is capable of scribing various silicon wafer, solar cell, ceramic wafer, thin metal sheet (~0.5 mm thick maximum), etc., in industries of electronics, semiconductor and solar energy, etc.. It is designed by experts with professional features, such as excellent beam quality and power stability, precise CNC worktable and efficient auto cooling system. Some of the most important parts are manufactured in UK, USA and Germany. Thanks to the automatic control of the whole system, you can save more efforts on the manufacturing, instead of how to operate and maintain the system.
2. Features
Excellent beam quality and system reliability
High-speed scribing (up to 120 mm/s), very low-defective index
Auto cooling system
Precise CNC worktable
Friendly man-machine interface and simple software operation
3. Technical Parameters
Laser medium Nd3+:YAG
Wavelength 1064 nm
Pump source Kr lamp
Laser cavity Ceramic
Modulated frequency 0.5 - 50 kHz
Beam power Adjustable, max 50 W
Aiming laser Red
Scribing speed Adjustable, max 120 mm/ s
Scribing depth Max 1.2mm
Line width Min 0.2mm
Worktable repeating accuracy 0.01mm
Marking area 300 mm í- 300 mm
Power supply 3-phase 4-wire AC 380V í+ 10%,50 Hz /60 Hz,PE,(A voltage stabilizer might be required to avoid irregular cutting quality caused by severe voltage fluctuation)
Input power Max 5kW
Dimension 550 mm x 290 mm x 650 mm
Net weight ~560 kg
Cooling Mode Water cooling
4.Standard Configuration
Laser machine í- 1 set
Exhauster í- 1 set
Vacuum pump í- 1 set
Cooling unit (Chiller, temperature controller, water tank, filter) í- 1 set
Worktable unit (CNC controller) í- 1 set
Kr lamp í- 2 pieces
Laser detector í- 1 piece
PC í- 1 set
Scribing software (In English) í- 1 set
Operation manual (In English) í- 1
1.Introduction
The laser scribing machine is specially designed for insulation of a-si (amorphous silicon) and back contacts such as aluminum coating of the a-si thin-film solar cell, without any damage to tco (transparent conductive oxidization) coating.
2. Features
Cnc worktable size: 900mm íß 1600mm
High-speed up to 500 mm/s or 200 íß 4
Auto programming / cooling / on-off
Kerfs width 0.05 ¿c 0.15 mm, continuously adjustable
3. Technical parameters
Wavelength 532 nm
Laser output stability ín ía 3%
Beam expanded angle ín 8 mrad
Scribing speed Continuously adjustable, max 250mm/s
Kerf width Continuously adjustable, 0.05 - 0.15 mm
Scribing area 900 mm íß 1600 mm
Power supply Single-phase ac 220v ía 10%, 50 hz /60 hz, pe, (a voltage stabilizer might be required to avoid irregular cutting quality caused by severe voltage fluctuation)
Input power Max 1500w
Cooling mode Air cooling
4.Standard configuration
Laser machine íß 1 set
Worktable unit (cnc controller) íß 1 set
Pc íß 1 set
Scribing software (in english) íß 1 set
Operation manual (in english) íß 1.
Wooden case
548 Wafer Scribing And Dicing Uv Laser Suppliers
Short on time? Let Wafer Scribing And Dicing Uv Laser sellers contact you.
1.Introduction
The laser scribing machine is specially designed for insulation of a-si (amorphous silicon) and back contacts such as aluminum coating of the a-si thin-film solar cell, without any damage to tco (transparent conductive oxidization) coating.
2. Features
Laser: lamp-pumping laser
Cnc worktable size: 500mm íß 500mm
High-speed up to250 mm/s
Auto programming / cooling / on-off
Kerfs width 0.05-0.15 mm, continuously adjustable
3. Technical parameters
Wavelength 532 nm
Pump source Kr lamp
Laser output stability ín ía 3%
Beam expanded angle ín 8 mrad
Scribing speed Continuously adjustable, max 250mm/s
Kerf width Continuously adjustable, 0.05 ~ 0.15 mm
Scribing area 500 mm íß 500 mm
Power supply 3-phase 4-wire ac 380v ía 10%, 50 hz /60 hz, pe, (a voltage stabilizer might be required to avoid irregular cutting quality caused by severe voltage fluctuation)
Input power Max 5kw
Cooling mode Water cooling
4.Standard configuration
Laser machine íß 1 set
Exhauster íß 1 set
Vacuum pump íß 1 set
Cooling unit (chiller, temperature controller, water tank, filter) íß 1 set
Worktable unit (cnc controller) íß 1 set
Kr lamp íß 2 pieces
Laser detector íß 1 piece
INDIUM PHOSPHIDE (InP) WAFERS are semiconductor materials made of indium phosphide, a compound semiconductor that is widely used in high-frequency and optoelectronic applications. Due to its efficient electron mobility and direct bandgap properties, InP is favored for devices such as:
High-speed electronics
Laser diodes
Photodetectors
Telecommunications applications, including optical fiber communication
We offer the following InP Wafers:
Undoped InP Wafers: These are pure InP with no intentional doping, used in various applications where intrinsic properties are required.
N-type InP Wafers: Doped with donor impurities (such as tellurium) to increase electron concentration, useful in transistors and high-speed electronics.
P-type InP Wafers: Doped with acceptor impurities (such as zinc) to create holes in the semiconductor, used in light-emitting devices and other optoelectronics.
InP Substrates: Used as a base for growing other semiconductor materials in heterostructures for various applications.
InP Membrane Wafers: Thin layers of InP used for specific applications, including applications in flexible electronics and advanced photonic devices.
InP-based Quantum Dot Wafers: Engineered to create quantum dots that can be used in photonic and optoelectronic devices for enhanced performance.
Sapphire wafers
These are thin slices of synthetic sapphire, commonly used as a substrate in a variety of high-tech applications. Sapphire, which is a crystalline form of aluminum oxide (Al�¢??O�¢??), is valued for its hardness, optical transparency, thermal stability, and chemical resistance. Here�¢??s a brief overview of their applications and properties:
Properties of Sapphire Wafers:
Hardness: Second only to diamond, sapphire is extremely scratch-resistant.
Optical Clarity: Transparent across a wide range of wavelengths (UV to infrared), making it ideal for optical components.
Thermal Stability: Can withstand high temperatures, which is useful in semiconductor processes.
Chemical Resistance: Highly resistant to acids and alkalis, ensuring durability in harsh environments.
Electrical Insulation: Sapphire is an excellent electrical insulator.
Uv laser marking machine
TypeKu1table, ku2 universal, ku3 rotary table
Laser type/wavelength 355nm
Laser power 1.5w3w5w10w
Beam quality m2<1.5
Pulse width 4-200ns
Frequency 20khz ~ 100khz
Pulse repetition frequency 100khz
Power stability >4h+/-3% rms
Peak power 125|¨¬j/10kw
Marking size 100mm x 100mm
180mm x 180mm or order
Marking depth Adjustable
Marking speed 15000mm/s
Marking width min 0.01mm(10|¨¬m)
Marking character min 0.1mm
Power total 700w
Working temp. 10 - 30
Power supply Ac 220v/50hz
Outsize 570*840*1240mm(difference by types)
Advantages:
1.Fully air cooling system;
2.Stable performance, low maintenance in 100, 000hours;
3.All kinds of metal materials and some non-metallic material marking, can be used for the depth of the moment, the applicability is very widely;
4.Control by computer, can freely change the marking and parameters;
5.Small laser spot, fine, unique and never wear marking effect.
Applications:
1.Areas with depth, smoothness and fine requirements;
2.Mobile phone keypad, plastic translucent keypad;
3.Electronic components, integrated circuits (ic), pcb;
4.Electrical appliances, communication products, signs;
5.Sanitary ware, hardware products;
6.Tool accessories, precision instruments panels;
7.Pvc pipe, medical equipment.
Usage
Precision cutting of fpc and organic membranes covering the board without the use of moulds or a protective plate. H, steep sidewall.
Fixed sample vacuum mode without using a matrix protection plate, convenient and efficient.
Used for a variety of substrate materials, such as: silicon, ceramics and glass.
Automatic correction, positioning and multi-board cutting functions. Automatic board thickness measurement and compensation. Full stroke motor compensation function. Improved cutting accuracy, reduced horizontal vibration. Improved depth cutting accuracy. Improved efficiency in cutting complex patterns.
Description-
The UV Laser Marking with its wavelength 355nm is suitable for marking plastics (ABS, PA) due to a high repetition rate. The UV laser wavelength is suitable and versatile in marking a wide range of materials and is perfect for â??cold markingâ?? applications where heat zones are not allowed.
UV Laser mark at very high speeds which are indispensable for short cycle times in industrial manufacturing environments. With high peak powers they are most suitable for fine marking and structuring without thermal impact on glass applications and/or ceramics.
The UV laser marking will mark plastics and silicon materials without the need of additives and will also mark glass with drastically reduced risk of micro fracture. The excellent beam quality also affords this laser the ability to be utilized in micro marking applications such as electronics, circuit boards and microchips in addition to solar panels and precise medical marking applications.
They also provide an excellent quality for classical laser marking applications and micro material processing.
Features-
Small beam diameter and fine marking line
Good quality and high laser beam stability
Complete machine stability, simple and easy operation
Narrow pulse width, small heat affected zone, work-piece without damage
Suitable for sensitive material as cold light source
Laser directly acting on molecular chain with maximum extend to avoid thermal effect
It works stably, applied in superbly precise marking, such as: LCD, wafer, chip ceramic, sapphire, precise surface marking of other materials,3C electronics, Lamps, food package, wire rod ,leather, ceramic, PCV, glass, Phone case, medicine bottle, fine marking on glass substrate, electric appliance marking and so on.
Technical Specifications-
Wavelength 335nm
Laser Beam Mode TEM00
Average Power Up to 2W
Positioning Visible Red Diode Light
Input Power 115/230VAC 50/60Hz
System Power Consumption < 950W
Cooling Air Cooled, active thermo-electric/Water Cooled
Operating Temperature Range 18 to 35C (64 to 95F)
Humidity 10% to 85% Non-condensing
STANDARD LENS CONFIGURATIONS FOCAL LENGTH
100 mm 65 mm X 65 mm (2.56 X 2.56)
160 mm 110 mm X 110 mm (4.33 X 4.33)
255 mm 175 mm X 175 mm (6.89 X 6.89)
The UV laser engraving machine adopts wavelength of 355nm. Due to a high repetition rate, it is particularly suitable for fine marking and structuring without thermal impact on materials. They reach very high speeds which are indispensable for short cycle times in industrial manufacturing environments. With high peak powers ,they are most suitable for many different materials.
Application of UV laser engraving machine:
Circular micrpchips, thin ceramics, IC crystal particles, glasses, LED, plasma screens, PCB,TFT fine tuning of electronic elements,textiles,Silicon,Sapphire, cosmetic, polymer materials such as wire, bottles (boxes) surface marking, and micro-holes,ABS,PA, ect.
Uv laser marking machine
TypeKu1table, ku2 universal, ku3 rotary table
Laser type/wavelength 355nm
Laser power 1.5w3w5w10w
Beam quality m2<1.5
Pulse width 4-200ns
Frequency 20khz ~ 100khz
Pulse repetition frequency 100khz
Power stability >4h+/-3% rms
Peak power 125|¨¬j/10kw
Marking size 100mm x 100mm
180mm x 180mm or order
Marking depth Adjustable
Marking speed 15000mm/s
Marking width min 0.01mm(10|¨¬m)
Marking character min 0.1mm
Power total 700w
Working temp. 10 - 30
Power supply Ac 220v/50hz
Outsize 570*840*1240mm(difference by types)
Advantages:
1.Fully air cooling system;
2.Stable performance, low maintenance in 100, 000hours;
3.All kinds of metal materials and some non-metallic material marking, can be used for the depth of the moment, the applicability is very widely;
4.Control by computer, can freely change the marking and parameters;
5.Small laser spot, fine, unique and never wear marking effect.
Applications:
1.Areas with depth, smoothness and fine requirements;
2.Mobile phone keypad, plastic translucent keypad;
3.Electronic components, integrated circuits (ic), pcb;
4.Electrical appliances, communication products, signs;
5.Sanitary ware, hardware products;
6.Tool accessories, precision instruments panels;
7.Pvc pipe, medical equipment.
The UV marking machine can engrave plastic, metal and leatherHigh precisionIt can also carve ceramic crystal. This price is for the final version 20 w power configuration
The UV marking machine can engrave plastic, metal and leatherHigh precisionIt can also carve ceramic crystal. This price is for the final version 20 w power configuration
Uv laser marking machine suitable for sapphire, quartz, ceramics, glass and other superhard materials, exquisite marking.
Suitable for mobile phones, ipad industry related accessories marking, such as mobile phone cover, touch screen, data cable, power supply, connectors, etc.
Widely used in food, medicine, cosmetics, wire and other polymer materials, the surface of the bottle marking, bore microporous.
RFH 355nm UV Laser Marking Module Used For Paint Stripping On Plastic
Buy UV laser
RFH is the leading industrial solid-state uv laser manufacturer in
Paint Stripping On Plastic,it is best to choose RFH 3w 5w 355nm UV Laser Marking Module
Comparing with its kinds, S9 series UV laser features with rugged sealed cavity, extremely compact size, simple and robust, high stability, high efficiency, high reliability and excellent laser beam quality.Its compact design suggests no necessity in building big light path, which greatly reduces space and cost and makes it easy to be installed into UV laser marking machines. In addition, S9 series cavity structure is more stability and more excellent scalability, which means the same laser cavity can be produces multi-power lasers , and the stability of different power ranges is greatly improved
S9 series uv laser characteristics
1. 355 nm output wavelength, Up to 200 Hz repetition rate; laser power ranging from 3w-10w; Continuous tuning of repetition rate while maintaining constant pulse energy, superior beam pointing and energy stability make the S9 the first choice for micromachining, marking and thin film removal applications
Benita from Brazil recently came to RFH, hoping to help her medical packaging line find a suitable new technology for marking dates. RFH 3w 5w 355nm UV nanosecond laser is a good choice. In the past, most of the production dates on the band-aids were carried out by inkjet coding technology. The ink marks on the marked products were uneven and unsightly, and the inner surface was deformed and easily altered. The ink needs to be replaced continuously during the marking process, and continuous In use, there must be a special person to take care of it.
The 3w 5w ultraviolet laser completely avoids the above-mentioned problems and avoids possible risks. The products marked by ultraviolet laser have good visual effect, no need to worry about tampering, and have the effect of anti-counterfeiting. In addition, the ultraviolet laser does not require other materials such as ink to participate, and can be operated as long as it is plugged in. The cost is low and there are no consumables, and the operation is simple and does not require special care. At the same time, UV laser marking does not produce any dust or ink pollution, and has no harm to the human body and the environment. It is an environmentally friendly green high-tech product.
The leading industrial solid-state laser manufacturer
355nm UV laser cold processing FPC flexible circuit board can avoid stress, burrs and dust.
FPC flexible circuit boards need to use ultraviolet laser drilling, cutting, and scribing technology.
Ultraviolet laser can prevent FPC flexible circuit board from breaking when drilling and cutting
Our common mobile phones, TVs, computers, kitchen induction cookers, rice cookers, range hoods, chargers, remote controls and other electronic devices all need FPC flexible circuit boards.
When designing the corners of the FPC soft board, if the design is not right, the FPC flexible circuit board is prone to breakage. For the mobile phone field, it requires narrower and thinner, in order to avoid the case of scratching and breaking with the shell in the FPC through hole of the mobile phone B/C part, it is necessary to use ultraviolet laser cutting and scribing technology.
Ultraviolet laser is a cold light source with low thermal influence, and the focused spot can be as small as 15um. There will be no deformation or scorching of the FPC circuit board due to the high energy of the laser beam. It is very suitable for FPC flexible circuit boards during Micro-hole drilling processing.
548 Wafer Scribing And Dicing Uv Laser Suppliers
Short on time? Let Wafer Scribing And Dicing Uv Laser sellers contact you.
