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Sending Inquiry For: Uv Laser Cutting Machine

Apr-18-14
 
Usage
Precision cutting of fpc and organic membranes covering the board without the use of moulds or a protective plate. H, steep sidewall.
Fixed sample vacuum mode without using a matrix protection plate, convenient and efficient.
Used for a variety of substrate materials, such as: silicon, ceramics and glass.
Automatic correction, positioning and multi-board cutting functions. Automatic board thickness measurement and compensation. Full stroke motor compensation function. Improved cutting accuracy, reduced horizontal vibration. Improved depth cutting accuracy. Improved efficiency in cutting complex patterns.
Please ask detailed and specific questions about Pricing, Minimum Order Quantity, Delivery Timelines etc. Detailed Messages result in prompt responses.

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