HT-65 high molecular weight polyamide resin especially designed for hot melt-adhesive use.
This resin has the characteristics of high softening point, and high molten viscosity so
that it is suitable for applications where high heat resistance, high creep strength, high adhesive
strength required and it is especially application for low pressure moulding.
HT-45 is a high molecular weight polyamide resin especially
designed for hot melt adhesive use. It is easy to soluble in mixed organic
solvent , such as aliphatic or aromatic hydrocarbons and alcohols type solvent.
This resin has the characteristics of good mechanical strength, heat resistance, flexibility
and long open times(good workability).
This product is suitable for bonds to many difficult substrates including : PCB parts, metals, plastics, leather and fabric.
KINGCURE X-165A is a low viscosity, modified aliphatic polyamines epoxy curing agent.
It has been designed for use in solventless coatings and leveling floorings where excellent flow,
good adhesion and high gloss films are required.
KINGMIDE 550 is a solid type fatty polyamide resin synthesized
by a polycondensation of mainly the dimerized fatty acid and the alkylenepolyamines.
The major applications of KINGMIDE 550 are in the rotogravure printing inks .
KINGMIDE 550 shows superior adhesion onto wide variety of surface so that it is highly useful
for rotogravure ink formulation .
KINGMIDE 310 is a polyaminoamide curing agent for liquid epoxy resin to achieve fast
cure more than KINGMIDE 305 at ambient temperature.
It has a high molecular weight and provide the cured products with high orders of flexibility, adhesion,
good chemical and water resistance. The major applications of KIMGMIDE 310 are for general adhesives,
civil engineering and construction.
KINGMIDE 300-65 is a polyamide type epoxy curing agent synthesized by polymerized
fatty acid and polyamines.
The resin component of KINGMIDE 300-65 is designed for high molecule weight and it is
therefore semi-solid in its form at an ambient temperature. However, for easy handling
at an actual application works, KINGMIDE 300-65 is dissolved
in the manufacturing process before being released to the users.
KINGMIDE 300-65, when cured with an epoxy resin, provides its cured films with such high
orders desired at actual application field as good flexibility, simultaneously with good water
resistance and good alkali resistance.
KINGMIDE 300-65 is thus desired for heavy duty primer coatings application of anti
corrosion resistance.
KINGCURE B-311 is a low viscosity, modified cyclo-aliphatic polyamines epoxy curing agent.
It has been designed for use in solvent-less coatings and leveling floorings where excellent flow,
good adhesion and high gloss films are required.
KINGCURE 367-KV is a modified aromatic polyamines type curing agent
for liquid epoxy resin.
Itis a medium viscosity and pot life, The surface hardness is more than
KINGCURE X-165A to the mixed resin .The major applications solventless
coatings and leveling floorings where excellent
flow, good adhesion and high gloss films are required.
KINGCURE X-2001 is a mannish type Epoxy Resin hardener. Based on aromatic amine
developed for low viscosity fast curing.
KINGCURE X-2001 can be used in all normal amine reactions . It is a slightly yellow
product and has only limited solubility in water.
The reactivity with epoxy resin is so high that no accelerator are required The cure takes
place at high atmospheric humidity at temperature down to 5and even under water.
KINGCURE N-768 is a rapid room temperature curing agent for epoxide resins.
It is a stable
liquid activated amine of particular use for solvent-free coatings, floor patch repair
kids,fast-setting adhesives,cold weather patching compounds and as an accelerator
for other amine and polyamide cures
KINGCURE 800-C is a mercaptan terminated liquid polymer which is imparts rapid-cure
characteristics to epoxy resins in combination with selected amines these systems are unique in
that they also provide rapid cure rates at low temperatures and thin film ,application in
construction adhesives(Bonding compounds)5min fast-setting adhesives.
KINGMIDE H-120 is a high molecular weight polyamide resin especially designed for hot
melt-adhesive use.
KINGMIDE H-120 is easy to soluble in mixed organic solvent , such as
toluene and alcohol type solvent. This resin has the characteristics of high softening point, and
high molten viscosity so that it is suitable for applications were high heat resistance and high
adhesive strength and good toughness are particularly needed.
KINGMIDE H-140HP is a high molecular weight polyamide resin especially
designed for hot melt-adhesive use. It is easy to soluble in mixed organic solvent such
as toluene and alcohol type solvent. This resin has the characteristics of good
mechanical strength, good heat resistance and flexibility. It is suitable for use in
sealing and electric parts adhesive .
KINGMIDE H-170HV is a high molecular weight polyamide resin especially designed for
hot melt-adhesive use.
KINGMIDE H-170HV is easy to soluble in mixed organic solvent
suchas toluene and alcohol type solvent. This resin has the characteristics of high softening
point, and high molten viscosity so that it is suitable for applications where high heat resistance
and high adhesive strength and good toughness are particularly needed.
T-558-N is a solid-type fatty polyamide resin especially designed for HOT-MELT
STRUCTUAL ADHESIVE uses. It has superior processing properties for its ready-to-apply nature
due to the lower molten viscosity. Optimum application temperature of T-558-N is in the
range of 180C~200C.
T-558-N shows excellent adhesion onto various types of plastics,
and steel, as well as onto many other surfaces, giving very tough bonding and sealing strength.
T-558-N may be applied either by hand or manually operated by hand-guns.
An automatic dispensing equipment with a nozzle or a wheel applicator may also be benefited.
KINGMIDE H-175SP is a high molecular weight polyamide resin especially designed for
hot melt-adhesive use. KINGMIDE H-175SP is easy to soluble in mixed organic solvent,
such as toluene and alcohol type solvent.
This resin has the characteristics of high softening point, and high molten viscosity
so that it is suitable for applications where high heat resistance and high
adhesive strength and good toughness.
