Adopting the most advanced microvia technology and ultra-fine line design, HDI PCB is a core substrate designed for miniaturised electronic products such as smartphones, wearable devices, medical electronics and high-end communication devices.
HDI PCB technical advantages and capabilities
1. High-order interconnect architecture Supports 1+N+1, 2+N+2, 3+N+3 and other multi-layer blind buried hole structure, the highest to achieve any-layer interconnect (Any-Layer), aperture diameter as low as 0.075mm, line width/spacing up to2mil/2mil (rigid board) and 0.025mm/0.025mm (flexible board), perfectly adapted to chip-scale packaging (CSP), system-in-package (SiP) and other cutting-edge technologies.
2. Ultra-thin dielectrics and fine lines Dielectric layer thickness is precisely controlled at 0.06-0.2mm, combined with ultra-thin copper foils (0.5-15oz inner layer, 0.5-10oz outer layer) to ensure signal integrity (SI) and power integrity (PI), and at the same time meet the requirements of chip-scale packaging (CSP), system-in-package (SiP) and other leading-edge technologies.Integrity (SI) and Power Integrity (PI), and at the same time meet the needs of thin and light designs (e.g., wearable devices, folding screen mobile phones).
3. Diversified surface treatment solutions Provide HASL (lead-free), ENIG (1-5" Au+80-200" Ni), electroless nickel-palladium-gold (ENEPIG), silver/tin immersion, etc., to adapt to harsh environments such as high temperature, high humidity, high frequency, etc., including hard gold plating (Au 1-50"/Ni 80-200" Ni).The hard gold plating (Au 1-50"/Ni 80-200") is especially suitable for connectors and wear-resistant contacts.
4. Flexible Circuits and Rigid-Flex Combination Flexible PCB (FPC) line width/spacing can be as thin as 0.025mm, with a bending radius as low as 0.1mm, supporting dynamic bending scenarios; Rigid-Flex Combination Boards (RBFBs) realise the seamless integration of rigid boards and flexible boards, and are widely used in drones, medical devices, and other applications. Widely used in drones, medical equipment and other high-reliability fields.
5. Mass production and quality assurance Monthly production capacity of 20,000 square metres, through the ISO 9001/14001/IATF 16949 system certification, equipped with AOI optical inspection, flying pin test and impedance control (�±10%) capabilities, to Ensure lead time and product yield.
Typical applications:
Motherboards and RF modules for smartphones/5G terminals
Wearable devices such as TWS headsets and smartwatches
High-end medical devices (e.g., portable ultrasound, implantable devices)
In-vehicle infotainment systems, ADAS sensor modules
Motherboards for high-performance servers and communication base stations.
