Supplier From
Shijiazhuang,
Hebei,
China
Supplier From
Shijiazhuang,
Hebei,
China
What is CMP Polishing?
Chemical Mechanical Planarization (CMP) is a critical process in semiconductor manufacturing, ensuring ultra-flat wafer surfaces by combining chemical etching and mechanical abrasion. The quality of CMP polishing liquid directly impacts device performance, yield rate, and production efficiency.
As a leading supplier of CMP raw materials, we provide ultra-high purity silicates, colloidal silica, and chemical additives to help semiconductor manufacturers achieve precise and defect-free wafer polishing.
Key Raw Materials for CMP Polishing Liquid
1. High-Purity Colloidal Silica
Role: Acts as the primary abrasive component in CMP slurries, ensuring controlled material removal rates and minimal defects.
Features:
Precisely controlled particle size distribution (20-100nm)
High purity to prevent contamination in semiconductor processes
Customizable formulations for different nodes (28nm, 14nm, 7nm, and below)
2. Electronic-Grade Silicates
Role: Used as a stabilizing agent and binder, enhancing slurry stability and polishing uniformity.
Application Areas:
Shallow trench isolation (STI) CMP
Copper and tungsten CMP processes
Silicon wafer planarization
3. Silica-Based Organic Dispersions
Role: Improves abrasive dispersion, prevents particle agglomeration, and enhances slurry flowability.
Benefits:
Reduces scratches and defects
Enhances CMP selectivity and precision
Compatible with various polishing platforms
4. High-Purity Chemical Additives
Role: CMP slurries require oxidizers, dispersants, pH stabilizers, and surfactants to achieve optimal polishing performance.
Key Additives We Supply:
Oxidizers (HO, Ferric Nitrate, etc.) for metal CMP
Dispersants & surfactants to prevent particle aggregation
pH regulators & complexing agents for slurry stability