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High thermal conductive silicone pad is a high thermal conductivity material. The raw material is made of Japan Electrochemical High Thermal Conductive Spherical Alumina Powder and Dow Corning Polymer. It is a cost-effective thermal gap filling material. The surface's natural micro-viscosity and softness can well fill the air gaps to transfer the heat between the heat source and the heat sink to improve heat dissipation and improve the efficiency of heating electro-nic components and service life. It is an ideal thermal interface material.

Benefits:
Cost-effective, high conductivity, low thermal resistance
Soft and flexible, reducing the interface thermal resistance
High electrical insulation to protect electronic devices
Natural sticky, easy application, reworkable
Meet ROHS and UL environmental requirements
Applications:
High thermal conductivity module
new energy vehicles
Microprocessors, memory chips and graphics processors
Network communication equipment
Car equipment, charger
High-speed hard disk drive

For more , please kindly feel free to contact

LGS300 graphite thermal pad is a new thermal interface material. It transfers heat along the two directions, shielding heat source and components meanwhile improving the performance of consumer electronics products. The thermal impedance of LGS is very small and can completely replace the high-performance thermal grease while avoiding the shortcoming of poor and dirty thermal grease process. LGS thermal conductivity is three-dimensional, that is not only it can transfer heat between the heat source and the radiator in the vertical direction, but also in the vertical direction, which ensures that it can quickly transfer heat out in vertical direction when the partial heat is high. Therefore, LGS thermal film is very suitable in the small space to efficiently transfer heat generated by heat source.
Features & Benefits:
Ultra-high thermal conductivity, easy to operate;
Low thermal resistance
Light weight
Typical Applications:
IC ; CPU; MOS; LED; Heat sink; LCD-TV; Laptop; Communication equipment; Wireless switch; DVD; Hand-held device; Camera/digital camera; Mobile phone

High thermal conductive silicone pad is a high thermal conductivity material. The raw material is made of Japan Electrochemical High Thermal Conductive Spherical Alumina Powder and Dow Corning Polymer. It is a cost-effective thermal gap filling material. The surface's natural micro-viscosity and softness can well fill the air gaps to transfer the heat between the heat source and the heat sink to improve heat dissipation and improve the efficiency of heating electro-nic components and service life. It is an ideal thermal interface material.
Benefits:
Cost-effective, high conductivity, low thermal resistance
Soft and flexible, reducing the interface thermal resistance
High electrical insulation to protect electronic devices
Natural sticky, easy application, reworkable
Meet ROHS and UL environmental requirements
Applications:
High thermal conductivity module
new energy vehicles
Microprocessors, memory chips and graphics processors
Network communication equipment
Car equipment, charger
High-speed hard disk drive

For more , please kindly feel free to contact rita(at)szutd.com

High thermal conductive silicone pad is a high thermal conductivity material. The raw material is made of Japan Electrochemical High Thermal Conductive Spherical Alumina Powder and Dow Corning Polymer. It is a cost-effective thermal gap filling material. The surface's natural micro-viscosity and softness can well fill the air gaps to transfer the heat between the heat source and the heat sink to improve heat dissipation and improve the efficiency of heating electro-nic components and service life. It is an ideal thermal interface material.
Benefits:
Cost-effective, high conductivity, low thermal resistance
Soft and flexible, reducing the interface thermal resistance
High electrical insulation to protect electronic devices
Natural sticky, easy application, reworkable
Meet ROHS and UL environmental requirements
Applications:
High thermal conductivity module
new energy vehicles
Microprocessors, memory chips and graphics processors
Network communication equipment
Car equipment, charger
High-speed hard disk drive

For more , please kindly feel free to contact rita(at)szutd.com