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Customer Precision Float Ball

Supplier From China
Sep-10-18

Precision float
Size :60---400
material :sus304
Thickness :0.6-4.0
pressure :8.0-3.2
Morphology :polishing
Connection type :freestyle

Precision float ball applies t trap valve, vent valve and check valve
precision float ball with fast delivery, long life, can be applied to many types of valves
More competitive price than their peers

Price and Minimum Quantity

Price: $5
MOQ: Not Specified

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More Items Similiar to: Customer Precision Float Ball

Sep-10-18

Customer Float Ball

$2 - $5
MOQ: Not Specified
 
customer float ball :

Such custom-made float, according to customer's drawings and technical requirements, we tailor-made for customers, before the formal production will be sent to customers to confirm samples, confirmed that the sample before the formal order form production,

Such products are made by the customer have higher requirements, such as high pressure / temperature and the like, we use imported materials to help customers produce, so these products by the customer's favorite
Dec-23-21
 
Detailed description of precision chip resistors
Series: 0805
Resistance: 0R 500M 0 22M full range
Power: 1/20W 1W
Deviation: D=±0.5%, B=±0.1%

Product features of precision chip resistors
1. Resistance error is ±0.5%, temperature coefficient is ±50ppm/â
2. Small size and light weight;
3. Adapt to reflow soldering and wave soldering;
4. Stable electrical performance and high reliability;
5. The assembly cost is low, and it is matched with the automatic mounting equipment;
6. High mechanical strength and superior high-frequency characteristics;
7. Comply with ROHS directive requirements.
8. Application areas include handheld products, computer products, industrial and medical instruments, etc.
Product parameters and characteristics of Pingshang Technology precision chip resistors
Inch (in) Metric (mm) Resistance Voltage Rated Power
0201 0603 0-47M 25V 1/20W
0402 1005 0-47M 50V 1/16W
0603 1608 0-47M 50V 1/16W, 1/10W
0805 2012 0-47M 150V 1/10W, 1/8W
1206 3216 0-47M 200V 1/8W, 1/4W
1210 3225 0-47M 200V 1/4W, 1/3W
1812 4832 0-47M 200V 1/2W
2010 5025 0-47M 200V 1/2W, 3/4W
2512 6432 0-47M 200V 1W
Dec-30-21
 
Detailed description of precision chip resistors
Series: 0805
Resistance: 0R 500M 0 22M full range
Power: 1/20W 1W
Deviation: D=±0.5%, B=±0.1%
Product features of precision chip resistors
1. Resistance error is �±0.5%, temperature coefficient is �±50ppm/â??;
2. Small size and light weight;
3. Adapt to reflow soldering and wave soldering;
4. Stable electrical performance and high reliability;
5. The assembly cost is low, and it is matched with the automatic mounting equipment;
6. High mechanical strength and superior high-frequency characteristics;
7. Comply with ROHS directive requirements.
8. Application areas include handheld products, computer products, industrial and medical instruments, etc.
Product parameters and characteristics of Pingshang Technology Precision Chip Resistor
Inch (in) Metric (mm) Resistance Voltage Rated Power
0201 0603 0-47M 25V 1/20W
0402 1005 0-47M 50V 1/16W
0603 1608 0-47M 50V 1/16W, 1/10W
0805 2012 0-47M 150V 1/10W, 1/8W
1206 3216 0-47M 200V 1/8W, 1/4W
1210 3225 0-47M 200V 1/4W, 1/3W
1812 4832 0-47M 200V 1/2W
2010 5025 0-47M 200V 1/2W, 3/4W
2512 6432 0-47M 200V 1W
Welcome friends who are interested to consult online
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MOQ: Not Specified
 
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IN tune with diversified applications, we are engaged in offering an excellent quality K Type Thermocouples. Our offered thermocouples are manufactured with precision using advance techniques in order to meet various needs of customers. Additionally, a series of quality tests are performed by our quality controllers on these thermocouples so as to eradicate any defect from this range.
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Product composition: tin 99.3 copper 0.7
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customizable
Product weight: can be customized
Solder ball is an indispensable and important material in new packaging. It is a new connection method that meets the requirements of electrical interconnection and mechanical interconnection. Due to the rapid development of BGA and CSP in recent years, it has replaced the traditional pin package and lead frame package, thus playing an important role in electrical interconnection and mechanical support in solder balls. BGA, CSP and other packaged devices connected by solder balls are widely used in notebook computers, mobile phones, PDAs, DSCs, LCDs and 3C products. This provides a broad application market and development prospects for solder ball products.
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