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Hdi R-F Multi-Layer Pcb With Hasl Finishing

Supplier From China
Oct-29-18

1.Material: FR-4 or other;
2.PCB with HASL Finishing;
3.Complied ROHS standard;
4.Vendor to be UL recognized;
5.Etch on Top/Bottom/Side Copper Layer;
6. All patterns according to Customer PCB Artwork/Film/Gerber File.

Item Mass Production
HDI structure 1+N+1,1+1+N+1+1
Buried hole Filled
Aspect ratio 0.75:1
Minimum laser hole 0.1mm(4mil)
Minimum laser pad 0.25mm(10mil)
Blind hole No filled
Rigid & Flex board NO
Press fit hole YES
Control Depth drilling YES
Lead-free &Halogen-free YES
Immersion Gold Ni:2-5µm Au:0.05-0.10µm
Immersion Tin 0.6-1.2µm
Immersion silver 0.2-0.6µm
OSP 0.1-0.4µm
HASL (Sn-Pb&LF) Pad:>3µm /Big Cu:>1µm
Flash Gold Ni:3-6µm Au:0.01-0.05µm


Inner Packing Vacuum Packing/Plastic Bag
Outer Packing Standard Carton Packing

Price and Minimum Quantity

Price: Negotiable
MOQ: Not Specified

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HDI R-F Multi-Layer PCB with HASL Finishing
• Vendor to be UL recognized
• All patterns according to Customer PCB Artwork/Film/Gerber File.
• Material: FR-4 or other
• Date code location: Printed on Top/Bottom/Side Silkscreen Layer
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Item Mass Production Prototype
HDI structure 1+N+1,1+1+N+1+1 2+N+2
Buried hole Filled Filled
Aspect ratio 0.75:1 0.75:1
Minimum laser hole 0.1mm(4mil) 0.1mm(4mil)
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Immersion Gold Ni:2-5µm Au:0.05-0.10µm Ni:3-6µm Au:0.075-0.15µm
Immersion Tin 0.6-1.2µm 0.6-1.2µm
Immersion silver 0.2-0.6µm 0.3-0.6µm
OSP 0.1-0.4µm 0.25-0.4µm
HASL (Sn-Pb&LF) Pad:>3µm /Big Cu:>1µm Pad:>4µm Big Cu:>1.5µm
Flash Gold Ni:3-6µm Au:0.01-0.05µm Ni:3-6µm Au:0.02-0.075µm.

HDI R-F Multi-Layer PCB with HASL Finishing
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• Date code location: Printed on Top/Bottom/Side Silkscreen Layer
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• All PCB will be electrical tested before shipment
• Legend Silkscreen: Top or Bottom side
• Solder mask color: Green/Blue/Yellow/Red/Other
• Complied ROHS standard
• Packing: Inner vacuum packing; Outer carton packing:
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