1.Material: FR-4 or other;
2.PCB with HASL Finishing;
3.Complied ROHS standard;
4.Vendor to be UL recognized;
5.Etch on Top/Bottom/Side Copper Layer;
6. All patterns according to Customer PCB Artwork/Film/Gerber File.
Item Mass Production
HDI structure 1+N+1,1+1+N+1+1
Buried hole Filled
Aspect ratio 0.75:1
Minimum laser hole 0.1mm(4mil)
Minimum laser pad 0.25mm(10mil)
Blind hole No filled
Rigid & Flex board NO
Press fit hole YES
Control Depth drilling YES
Lead-free &Halogen-free YES
Immersion Gold Ni:2-5µm Au:0.05-0.10µm
Immersion Tin 0.6-1.2µm
Immersion silver 0.2-0.6µm
OSP 0.1-0.4µm
HASL (Sn-Pb&LF) Pad:>3µm /Big Cu:>1µm
Flash Gold Ni:3-6µm Au:0.01-0.05µm
Inner Packing Vacuum Packing/Plastic Bag
Outer Packing Standard Carton Packing