HDI R-F Multi-Layer PCB with HASL Finishing
• Vendor to be UL recognized
• All patterns according to Customer PCB Artwork/Film/Gerber File.
• Material: FR-4 or other
• Date code location: Printed on Top/Bottom/Side Silkscreen Layer
• Etch on Top/Bottom/Side Copper Layer.
• All PCB will be electrical tested before shipment
• Legend Silkscreen: Top or Bottom side
• Solder mask color: Green/Blue/Yellow/Red/Other
• Complied ROHS standard
• Packing: Inner vacuum packing; Outer carton packing:
• FOB Port: Shenzhen or HK.

HDI
Item Mass Production Prototype
HDI structure 1+N+1,1+1+N+1+1 2+N+2
Buried hole Filled Filled
Aspect ratio 0.75:1 0.75:1
Minimum laser hole 0.1mm(4mil) 0.1mm(4mil)
Minimum laser pad 0.25mm(10mil) 0.25mm(10mil)
Blind hole No filled No filled
Rigid & Flex board NO YES
Press fit hole YES YES
Control Depth drilling YES YES
Lead-free & Halogen-free YES YES
Immersion Gold Ni:2-5µm Au:0.05-0.10µm Ni:3-6µm Au:0.075-0.15µm
Immersion Tin 0.6-1.2µm 0.6-1.2µm
Immersion silver 0.2-0.6µm 0.3-0.6µm
OSP 0.1-0.4µm 0.25-0.4µm
HASL (Sn-Pb&LF) Pad:>3µm /Big Cu:>1µm Pad:>4µm Big Cu:>1.5µm
Flash Gold Ni:3-6µm Au:0.01-0.05µm Ni:3-6µm Au:0.02-0.075µm.

HDI R-F Multi-Layer PCB with HASL Finishing
• Vendor to be UL recognized
• All patterns according to Customer PCB Artwork/Film/Gerber File.
• Material: FR-4 or other
• Date code location: Printed on Top/Bottom/Side Silkscreen Layer
• Etch on Top/Bottom/Side Copper Layer.
• All PCB will be electrical tested before shipment
• Legend Silkscreen: Top or Bottom side
• Solder mask color: Green/Blue/Yellow/Red/Other
• Complied ROHS standard
• Packing: Inner vacuum packing; Outer carton packing:
• FOB Port: Shenzhen or HK .