The UV laser marking machine is developed by using a 355nm UV laser. This machine uses a third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355nm UV laser has a very small spot, and the marking effect is directly interrupted by a short-wavelength laser. The molecular chain greatly reduces the mechanical deformation of the material. Thermal deformation (cold light), because it is mainly used for ultra-fine marking and engraving. It is especially suitable for applications such as marking, micro-hole drilling of food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.
Supplier: Low, medium and high power fiber laser cutting machine, co2 laser cutting&engraving machine, laser marking machine, laser welding machine Services: OEM Buyer: Low, medium and high power fiber laser cutting machine, co2 laser cutting&engraving machine, laser marking machine, laser welding machine
1. Lightweight,energy-saving and maintenance-free Integrated air-cooled structure. Volume only 0.15m�³.
2. 6 preset cleaning processes+ 3 custom ones Corresponding to different usage requirements. Simple operation.
3. Double-wobble Cleaning Head Scanning width up to 190mm.
4. 8 Light Modes Meet various operation requirements.
5. High Power Density and Strong Output.Energy is twice that of ordinary models, effectively addresses issues of difficult cleaning and inefficiency.
