General specification for flexible & rigid-flex printed circuit board
Layer count: 1-6l(flex) & 2-10l(rigid-flex)
Board thickness: 0.05-3.0mm
Base polyimide film thickness: 0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ).
Copper thickness: 1/3oz (12µ), 1/2oz (18µ), 1oz (35µ), 2oz (70µ)
Stiffeners: polyimide, fr4, metal
Min trace width/spacing: 3/3mil(0.075/0.075mm)
Min drill size: 0.2mm
Surface treatment: immersion gold/tin, gold/tin plating, osp
Vacuum package
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questions about Pricing, Minimum Order Quantity, Delivery Timelines etc. Detailed Messages
result in prompt responses.
