MAK series mobile head pipe cutting machines are upgraded portable saddle hole cutting machines with multi-functions.They could cut larger holes on the pipe head and pipes in multi-orientations to achieve a satisfied cutting solution.This series cutting machines represent the highest cutting skills in pipe cutting filed.
Products Features:
Smoothly,accurately cut and bevel .
Light and portable for more occasions working .
Positioning by laser to achieve precise cutting process .
With remote controller,highly intelligent but simple to operate .
With magnet base,easy to install and removal by only one man .
Build-in program system in the controller,no need tie in with CAD skill .
Cutting methods could be flame cutting, plasma cutting and water jet cutting .
Able to cut pipes with spherical head & torispherical head & spherically dished head.
Easy to cut orthogonal or eccentric holes on pipes with stainless steel or carbon steel materials.
Meet saddle hole cutting of heads in the national standard (GB 150.3 2011) pressure vessel design.
CNC cutting machine for cutting soft materials like fabric, and leather, etc., automatic oscillating knife cutting machine, Intelligent CNC, no need knife dies, reducing costs and increasing efficiency.
MAK series pipe cutting machines are the smartest as well as lightest pipe saddle-holes cutting machines the world has ever have!They are also the newest cutting equipment, combining quick working, numerical control, precision and super-miniaturization together.These machines are used mainly for cutting saddle hole on pipes and tubes in steel construction, process industry and petroleum and gas & oil pipeline transportation fields.
Products Features:
Smoothly,accurately cut and bevel
Light and portable for more occasions working
Positioning by laser to achieve precise cutting process
With remote controller,highly intelligent but simple to operate
With magnet base,easy to install and removal by only one man
Build-in program system in the controller,no need tie in with CAD skill
Cutting methods could be flame cutting, plasma cutting and water jet cutting
Best Cheap Price Meat grinder machine is a meat processing machine with high versatility and wide application scope in the meat products production industry.It is to rely on the screw hopper box in the raw meat pushed to the pre-cut plate ,through the screw rotation extrusion hole plate and reamer generated relative operation ,so as to cut the raw meat into grain shape ,to ensure the uniformity of meat ,through the different combination of hole plate cn achieve the ideal requirements of different meat .Meat process machine meat making machine .
Capacity 500-4000kg/hour for different client meat processing needing .
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Multifunction vegetable cutting machine is widely used in the processing of hard and soft root, stem and leaf vegetables such as potatoes, celery, leeks, garlic, beans, bamboo shoots, rice cakes and kelp ,etc . many kinds vegetables with different shape : slike, stick ,slice ,dice ,sectioning,etc .from different cutter head molde .
Capacity:
Leafy vegetable 300-1000kg/hour with 1-60mm length can be adjustable;
Root vegetable 600-1000kg/hour with 1-10mm thickness can be adjustable .
Dice thickness 6-20mm can be adjustable .
4920 Mobile Heads Saddle Hole Cnc Cutting Machine Mak Suppliers
Short on time? Let Mobile Heads Saddle Hole Cnc Cutting Machine Mak sellers contact you.
Multifunction vegetable cutting machine is widely used in the processing of hard and soft root, stem and leaf vegetables such as potatoes, celery, leeks, garlic, beans, bamboo shoots, rice cakes and kelp ,etc . many kinds vegetables with different shape : slike, stick ,slice ,dice ,sectioning,etc .from different cutter head molde .
Capacity:
Leafy vegetable 300-1000kg/hour with 1-60mm length can be adjustable;
Root vegetable 600-1000kg/hour with 1-10mm thickness can be adjustable .
Dice thickness 6-20mm can be adjustable .
2-head packaging machine (also can 4-18head according different capacity choice)
Packaging speed 15bags/min
Bag length 90-320mm
Bag width 80-210mm
Overall weight 400kg
Power 1.8kw/220v
Packaging capacity 20-1000ml
Outer packaging size 820 x1220 x 2500mm
Packaging form Back sealing
This machine is an intelligent weighing automatic quantitative packaging machine with four scales and microcomputer control. Suitable for quantitative packaging of granular materials such as miscellaneous grains, nuts ,pesticides, fertilizers, veterinary drugs, premixes, additives, laundry detergent, salt, monosodium glutamate, white sugar, seeds, rice, snacks, hardware, etc.
Performance characteristics:
1. High precision digital sensors enable precise measurement to be achieved instantly.
2. The microcomputer control system is technologically advanced, easy to operate, and more reliable to use.
3. Fast and slow vibration feeding, automatic correction of errors, achieving high-precision packaging.
4. Four scales work alternately, with fast packaging speed.
5. High quality stainless steel is used for the material contact part, which is anti-corrosion, dust-proof, and easy to clean.
Host configuration:
This machine is equipped with a dual CPU microcomputer control system, a 5-inch LCD display in Chinese or English, a user-friendly operation interface, automatic cursor detection and tracking, and simpler operation. Equipped with high-precision stepper motors to ensure the accuracy of the cutting position of each packaging bag.
The UV laser marking machine is developed by using a 355nm UV laser. This machine uses a third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355nm UV laser has a very small spot, and the marking effect is directly interrupted by a short-wavelength laser. The molecular chain greatly reduces the mechanical deformation of the material. Thermal deformation (cold light), because it is mainly used for ultra-fine marking and engraving. It is especially suitable for applications such as marking, micro-hole drilling of food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.
