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Ultradispersed Ultrafine Copper Powder (5N/99.999% & 6N/99.9999% Oxygen-Free)
Isotopic composition: Cu-63: 69.09% +/- 0.05% Cu-65: 31.91% +/- 0.05%

Ultrafine high-purity copper powder is supplied as a finely dispersed metallic powder, typically featuring a controlled spherical or dendritic particle morphology and grain size in the micrometer or sub-micrometer range. Engineered for uniform dispersion, high surface area, and predictable sintering behavior, this form factor is ideal for advanced applications such as powder metallurgy, additive manufacturing, microelectronics, and catalysis.

The performance of ultrafine high-purity copper powder is directly influenced by the presence of impurities. Even minimal traces of elements like oxygen, chromium, vanadium, manganese, titanium, zirconium, or niobium can significantly reduce the materialâ??s conductive efficiency. This is why tight control of composition and oxygen content is essential during production, particularly for use in microelectronics, vacuum devices, energy systems, and other high-tech applications.

Supply forms & packaging:
** 250g glass ampoules, hermetically sealed under argon atmosphere, shipped in protective cases.
** 2kg PET containers, sealed under argon atmosphere, shipped in plastic boxes.