Layer: 1 to 16 layers
Material type: FR-4,CEM-3,High TG,FR4 Halogen Free,RIGID-FLEX
Board thickness: 0.20mm to 3.4mm
copper thickness: 0.5 OZ to 6 OZ
copper thickness in hole: >25.0 um(>1mil)
Max size of finish board: 700*460mm
Min.Drilled Hole Size: 1.0mm
Min.Line Width: 3mil
Min.Line Spacing: 3mil
Surface finishing:
HASL/HASL lead free,HAL,Chemical tin,Chemical Gold,
Immersion Silver/Gold,OSP,Gold plating
Solder Mask Color: Green/Yellow/Black/White/Red/Blue
Shape tolerance: ±4mil
Hole tolerance: PTH:±3mil,NPTH:±2mil
Package:
Inner paking/Plastic bag,Outer packing:Standard
carton packing
Certificate: UL,SGS, ISO 9001:2008,IATF16949
Special requirements: Buried and blind vias+controlled impedance+BGA
Profiling: Punching,Routing, V-CUT,Beveling