Printed Circuit Board (Pcb) Assembly

1Layer1-30 layer
2MaterialFr-4, cem-1, cem-3, hight tg, fr4 halogen free, fr-1, fr-2, aluminum
3Board thickness0.2mm-7mm
4Max.Finished board side500mm*500mm
5Min.Drilled hole size0.2mm
6Min.Line width0.075mm(3mil)
7Min.Line spaceing0.075mm(3mil)
8Surface finish/treatmentHals/hals lead free, chemical tin, chemical gold, immersion gold inmersion silver/gold, osp, gold plating
9Copper thickness0.5-6.0oz

Technical Capability:

Product type

FR4+FCCL(Flexible Copper Clad Laminate)rigid flex PCB

Material

FR4+FCCL

Field of application

military industrial

Layers/thickness

4L/1.2mm

Line Space/width

6/6mil

Surface treatment

ENIG

Minimum hole dia.

0.2mm

Technical feature

special material,rigid-flex technology

We OffeCircuit Boardr a Full Range of Printed Circuit Board Capabilities to Fit All of Your PCB Needs

Process Item Craft Capacity
Prepares materials Base Material FR4, CEM-1, Aluminium, High Tg Material, Halogen-free Material
Lamination press Layer Count 1-12Layers
Thickness 0.2-3.0mm
Drill Min.Hole Diameter 0.15mm (mechanical drill), 0.1MM (laser drill)
PTH Diameter Tolerance + / - 3mil
NPTH Diameter Tolerance + / - 2mil
Outer layer Min.Line/Space 3.5mil/3.5mil
Copper Thickness 1- 6oz
Impendence Impedance tolerance ±10% (±5%(Need assessment)
Solder Masking Min.Solder Dam 0.1mm
Min.Solder Mask Opening 0.075mm
Color Green, White, Red, Yellow, Black, Blue
Surface Treatment LF-HASL, OSP,Ni/Au Enig,Immersion Tin, Immersion Silver, carbon oil;

Out-Line Profiling Profile Tolerance + / - 0.12MM
V-cut Remain Thickness Tolerance + / - 0.1MM
V-cut Angle Tolerance + / - 5°
Testing E-Testing 100% E-Testing (High Voltage Testing); Flying Probe Testing
Final Product Thickness Tolerance + / - 10%
Warpage Tolerance + / - 0.75%

Lead Time Double layer PCB Multilayer PCB Mass production
Normal 6 work days Normal 8 work days Double layer 9-12 work days
Urgent 3 work days Urgent 6 work days Multilayer 12-15 work days
Email:sales5@(keyoupcb.com)

Learn more from our website:www.keyoucircuit.com

ADD:Room K221,jinhetian Center,QINGHU AREA,SHENZHEN, Guangdong,China

Material: FR-4 Tg135
PCB Size:158.75*118.6mm
Board thickness: 1.6mm
Surface finished: HAL LF
Copper thickness: 1/1 Oz
Min through hole: 0.2mm
Consumer Electronics

Product type 2 Layer Metal Base PCB
Material Copper base
Layers/thickness : 2L/1.6mm
Line Space/width : 25/30mil
Surface treatment : ENIG
Minimum hole dia. 2.5mm
Outer Layer Copper Thickness 1/1 OZ

Material: Aluminum Bases
Layer/Thickness: 2L/1.6 mm
Copper Thickness:1 OZ
Surface treatment:ENIG
Min Line Width: 0.13mm
Min Line Space: 0.12mm
Min Hole:0.32mm
Solder Mask:White
Technical featuer: special materials
Application Field: High frequency amplifier

10layers HDI PCB
Base material: FR4, Tg170
Surface finishing: immersion gold
Board thickness: 1.0mm
Copper thickness: 0.5oz
Minimum line width: 0.1mm
Minimum line spacing: 0.1mm
Laser drilling + blind and buried drilling Impedance control
Board stack up: 1+8+1
Impedance control

Layer NO# 1 or 2Layers
Material: Aluminum 0.80~3.80W/m.k
Finished Thickness: 1mm or 1.6mm
Outer Copper: 1 ~3 OZ
Surface treatment: HASL LF / OSP / ENIG

Copper Base PCB, Metal PCB is the thermal conductivity dielectric material in the MCPCB. This acts as a thermal bridge between the IC components and the metal backing plate.

Heat is conducted from the package through the metal core to an additional heat sink. On the FR4 board the heat remains stagnant if not transferred by a topical heatsink.

LED PCB always be produced with Aluminum core, but sometimes steel core PCB and copper core PCB also be used.

Copper Base PCB Metal PCB

ENIG White 1 Layer,

Copper base material.

Finished board thickness is 1.6mm.

White solder mask

1 Oz finished copper thickness.

Surface Finish is ENIG 2u