Kb 1631 Aolv-1

PRODUCT HIGHLIGHTS
Superior thermal conductivity
Low coefficient of thermal expansion (CTE)
Excellent flow properties
Superior dimensional stability
Exceptional electrical insulation properties
Easy mix ratio of 1:1 by weight or volume

Kohesi Bond KB 1631 AOLV-1 is a two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It offers a favorable one to one mix ratio by weight or volume. In addition, it has a long open time, a low exotherm and good flow properties when mixed, making it ideal for potting and encapsulating. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours.

KB 1631 AOLV-1 offers an extensive serviceable temperature range of -50°C to +120°C. Also, it is a phenomenal adhesive that fosters outstanding physical strength properties and low coefficient of thermal expansion (CTE). KB 1631 AOLV-1 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation and thermal conductivity, KB 1631AOLV-1 also offers astounding chemical resistance to a variety of fuels, oils and water. Part A has a gray color and Part B has an off-white color. Owing to its remarkable performance and ease of use KB 1631 AOLV-1 is widely used in electronics, optoelectronic, major OEM and similar applications.

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