Layers:1-50 layers
Material:FR4 standard Tg 130C, FR4 medium Tg 150C, FR4 high Tg 170C
Board Thickness:.0079"-.126"(0.2mm-8.0mm)
Copper Thickness:0.5oz-12oz(18um-210um)
Inner layer Copper Thickness:0.5oz-6oz(18um-70um)
Board size:1200x700mm
Min Tracing/Spacing:3.0mil/3.0mil
Min Annular Ring:3mil
Min drilling Hole diameter:0.2mm(8mil), 0.1mm(4mil)-laser drill
Solder Mask:Green, Green matt, Black, Black Matt, White, Red, Yellow, Blue
Silkscreen color:
White, Blue, Black, Red, Yellow,no
Surface finish:
HASL -Hot Air Solder Leveling
Lead Free HASL - RoHS
ENIG -Electroless Nickle/Immersion Gold - RoHS(Thick of Au 1-4 u")
Immersion Silver - RoHS
Immersion Tin - RoHS
OSP -Organic Solderability Preservatives - RoHS
Surface/Hole plating thickness:20-30um
Board thickness tolerance:0.1mm ~ 10%
Board size tolerance:0.1mm~0.3mm
PTH hole size tolerance:.003"(0.08mm)~.006"(0.15mm)
NPTH hole size tolerance:.002"(0.05mm)
Copper thickness tolerance:+0um+20um
Impedance tolerance:5%~10%
SMD Pitch:0.2mm(8mil)
BGA Pitch:0.2mm(8mil)
Aspect Ratio(hole size: board thickness):1:40
Chamfer of Gold Fingers:20, 30, 45, 60
Supplier: Gas lighter, led screen protector ( not even in domestic ), refill paper cups, table runner, earing brass clamp, auto brass electric parts, cashew nuts, wire mesh, petha sweet, niwar, mohini powder, vermicompost, dry bath incubator, test tube plastic, sordium citrate tube, health care product, ornamental freshwater fish, safed musli, used polymer bag, cotton linter, auto hood cover,
areca plate, rice