1.Express PCB
2.Multilayer PCB(2~30layer)
3.High Frequency Board
4.Flexible Printing Board
5.Blind/buried Board
6.High Tg Thick Copper PCB
7.Metal Core Board
8.Metal Base Board(Al, Cu, Fe)
9.Mix-material Multilayer PCB
10.Flat Winding Multilayer PCB
11.Embedding Resistance/Capacitance Board
12.Flexi-rigid Printed Board
13.Halogen-ree/Lead-free Board
14.Thick Gold Plating/Immersion Gold Board.
4 layer board, blud soldermask, immersion gold surface finishing. Depend on customer requirements.
2 layers rigid-flex pcb Minimum line width/space: 8mils Surface finish: immersion gold Board thickness: 0.50mm Minimum drilled hole diameter: 8mils Copper thickness: 0.5oz Special process : 0.10mm flexible pcb inside Carton
green solder mask PCB, OSP printed circuit board 1) Thickness: 0.1mm-5mm 2) Minimum linewidth 0.075mm/3mil 3) Minimum gap 0.065/2.8mil 4) Minimum aperture inradium 0.15mm 5) Minimum aperture external diameter 0.45mm 6) Minimum BGA: 0.2mm 7) Layer 4 layers through hole non-impedance All multilayer boards are printed with 36t screen, the resistance welding oil is 50 tons thicker than the traditional 43t, which provides reliability guarantee for the bga and more precise fine lines.
We have a design team with an industry experience of more than 12 years.We promise that each PCB is from our experienced designers, we will provide you perfect one-to-one service with the fastest delivery in the industry . (For example, we used to completed 10000pins PCB design excellently in 5 days.)
We are specializes in the manufacture of a wide range of board types. The emphasis on R&D has helped us become a market leader in the development and manufacturing of advanced PWBs. Our capabilities enable us to offer: Rigid boards up to 42 layers Flex and Rigid-Flex boards up to 40 layers Hybrid solutions for Microwave/RF applications Thermal and signal integrity management solutions, employing coins and cavities 2D or 3D heat-sinks: Copper and Aluminum Carbon printing HDI blind, buried, staggered & stacked vias Buried passive components: capacitors and resistors In-house HATS lab
We have a design team with an industry experience of more than 12 years.We promise that each PCB is from our experienced designers, we will provide you perfect one-to-one service with the fastest delivery in the industry . (For example, we used to completed 10000pins PCB design excellently in 5 days.)
We are specializes in the manufacture of a wide range of board types. The emphasis on R&D has helped us become a market leader in the development and manufacturing of advanced PWBs. Our capabilities enable us to offer: Rigid boards up to 42 layers Flex and Rigid-Flex boards up to 40 layers Hybrid solutions for Microwave/RF applications Thermal and signal integrity management solutions, employing coins and cavities 2D or 3D heat-sinks: Copper and Aluminum Carbon printing HDI blind, buried, staggered & stacked vias Buried passive components: capacitors and resistors In-house HATS lab
We have a design team with an industry experience of more than 12 years.We promise that each PCB is from our experienced designers, we will provide you perfect one-to-one service with the fastest delivery in the industry . (For example, we used to completed 10000pins PCB design excellently in 5 days.)
We are specializes in the manufacture of a wide range of board types. The emphasis on R&D has helped us become a market leader in the development and manufacturing of advanced PWBs. Our capabilities enable us to offer: · Rigid boards up to 42 layers · Flex and Rigid-Flex boards up to 40 layers · Hybrid solutions for Microwave/RF applications · Thermal and signal integrity management solutions, employing coins and cavities · 2D or 3D heat-sinks: Copper and Aluminum · Carbon printing · HDI blind, buried, staggered & stacked vias · Buried passive components: capacitors and resistors · In-house HATS lab
We are specializes in the manufacture of a wide range of board types. The emphasis on R&D has helped us become a market leader in the development and manufacturing of advanced PWBs. Our capabilities enable us to offer: · Rigid boards up to 42 layers · Flex and Rigid-Flex boards up to 40 layers · Hybrid solutions for Microwave/RF applications · Thermal and signal integrity management solutions, employing coins and cavities · 2D or 3D heat-sinks: Copper and Aluminum · Carbon printing · HDI blind, buried, staggered & stacked vias · Buried passive components: capacitors and resistors · In-house HATS lab
