Tri-Temperature Test Product

Mainly used in the semiconductor packaging industry, it can be used for various types of integrated packaging.
Tri-Temperature Test Handler Precision Thermal Test
Our Tri-Temperature Test Handler delivers reliable, repeatable thermal testing across the full tri-temp spectrum so you can validate device performance where it matters most â?? from extreme cold to high heat. Designed for engineering labs and scalable to production lines, this handler combines precise thermal control, high throughput multi-site testing, and broad device compatibility to shorten time-to-market and reduce test costs.
Benefits of Tri-Temperature Handler

Wide, industry-grade temperature range for true tri-temp testing (cold ambient hot), supporting the full range of device characterization and qualification needs.
 Active thermal control (ATC) and multi-zone temperature management keep DUT temperatures stable and uniform during high-power or long soak tests, improving data quality and yield.
 Multi-site parallel testing and optimized handling mechanics deliver high units-per-hour throughput while minimizing jams and socket wear ideal for semiconductor production and high-volume validation.
Flexible cooling/heating architectures (LN or modern refrigerant thermal engines) let you match performance to cost and facility constraints.
 Engineered to support a wide array of package types (QFN, BGA, QFP, TO-packages, SOT23, etc.) and easy kit changeover for fast product mix-shifts.

Technical Highlights
Full tri-temp capability with precision thermal control for accurate soak and transition cycles.
 Configurable parallelism (single-site up to multi-site arrays) so you can prioritize throughput or per-device characterization as required.
Industry-proven sockets, thermal engines, and pre-heat designs that integrate seamlessly with ATE test heads and common production workflows.
 Robust mechanical design for long MTBF and easy maintenance reduces downtime and total cost of ownership.