The prepreg dielectric provides excellent heat transfer from the foil and components to the base plate, while maintaining excellent electrical isolation. The base aluminum/copper plate gives the single-sided substrate mechanical integrity, and distributes and transfers the heat to a heat sink, mounting surface or directly to the ambient air.
The Single-Layer MCPCB can be used with surface mount and chip & wire components, and provides much lower thermal resistance than FR4 PWB. The metal core provides lower cost than ceramic substrates, and allows much larger areas than ceramic substrates.
The prepreg dielectric provides excellent heat transfer from the foil and components to the base plate, while maintaining excellent electrical isolation. The base aluminum/copper plate gives the single-sided substrate mechanical integrity, and distributes and transfers the heat to a heat sink, mounting surface or directly to the ambient air.
The Single-Layer MCPCB can be used with surface mount and chip & wire components, and provides much lower thermal resistance than FR4 PWB. The metal core provides lower cost than ceramic substrates, and allows much larger areas than ceramic substrates.
A simple layer single sided MCPCB consists of a metal base (usually aluminum, or copper alloy), Dielectric (non-conducting) Layer, Copper Circuit Layer, IC components and solder mask.
The prepreg dielectric provides excellent heat transfer from the foil and components to the base plate, while maintaining excellent electrical isolation. The base aluminum/copper plate gives the single-sided substrate mechanical integrity, and distributes and transfers the heat to a heat sink, mounting surface or directly to the ambient air.
The Single-Layer MCPCB can be used with surface mount and chip & wire components, and provides much lower thermal resistance than FR4 PWB. The metal core provides lower cost than ceramic substrates, and allows much larger areas than ceramic substrates.
INDIUM PHOSPHIDE (InP) WAFERS are semiconductor materials made of indium phosphide, a compound semiconductor that is widely used in high-frequency and optoelectronic applications. Due to its efficient electron mobility and direct bandgap properties, InP is favored for devices such as:
High-speed electronics
Laser diodes
Photodetectors
Telecommunications applications, including optical fiber communication
We offer the following InP Wafers:
Undoped InP Wafers: These are pure InP with no intentional doping, used in various applications where intrinsic properties are required.
N-type InP Wafers: Doped with donor impurities (such as tellurium) to increase electron concentration, useful in transistors and high-speed electronics.
P-type InP Wafers: Doped with acceptor impurities (such as zinc) to create holes in the semiconductor, used in light-emitting devices and other optoelectronics.
InP Substrates: Used as a base for growing other semiconductor materials in heterostructures for various applications.
InP Membrane Wafers: Thin layers of InP used for specific applications, including applications in flexible electronics and advanced photonic devices.
InP-based Quantum Dot Wafers: Engineered to create quantum dots that can be used in photonic and optoelectronic devices for enhanced performance.
Name of Product : Arecanut palm leaf plates and cups.
Made of : Arecanut palm tree leaf (Sheath).
Nature of product: Purely natural & Eco-friendly, Chemical free.
Botany name : Areca catechu Linn.
Manufacturing method: Getting shape by hydraulic mechanical press with heated metal
mould.
Product Specification
Shapes : Round, Oval, Square, Rectangle, Hexagonal. .Etc.
Thickness : 2-4 mm
Depth : 20-35 mm
Size : 100 mm-300 mm
Above Sizes as follows: Apart from the below sizes, we can tailor to any preferred size and shape
depending on the requirement.
18 cm â?? Rectangle
20 cm - Round Side
24 cm â??Square
25 cm - Hexogen Main
25 cm-Rectangle Plate
25 cm - Round Plate
13 cm â?? Heart
13 cm - Dip Bowl
16 cm Rectangle
17cm Square
18 cm Round Bowl
24 cm Square New
LEAD Free HASL1 Layer / Single Side, Rigid PCB/PCBA
1. SMT service;
2. Design service, Gerber drawings;
3. Good quality and fast delivery with lower price than double side PCB.
Specifications of LEAD Free HASL 1 Layer / Single Side Rigid PCB/PCBA:
1) Base material: FR-1(94v0), FR-4, CEM-1,
2) Max Board size: 600*600mm
3) Board thickness: 0.2mm/0.6mm/0.8mm/1.2mm/1.6mm/3.2mm
4) Copper thickness: 0.5oz , 1oz , 2oz ,3oz,4oz, 5oz ,7oz , 11oz
5) Special tech: BGA, PTH, Blind and buried vias
6) Profile: V-scoring, V-cutting, punching, etching, milling, routing
7) Surface treatment: HASL, OS, Immersion gold, gold plated (coating)
8) With best price to USA, South American, India, South Africa and Europe
9) Main market: USA, EGYPT, Europe, South American, mid-east
10) Compliant: UL, ROHS, ISO9001-2000
11) Standard: IPC-A-600F, IPC-D-300G, MIL-STD-105D LEVEL II
12) Application: Home appliances, electronics, digital camera, LCD TV sets, medical quipments, telecommunication, LED lightings, street light, mobile phone, computer, laptop test equipment and power meter, electrical weighing scale, night.
13) Small quantity and prototypes acceptable.
14) Lead time: 5-7days for prototypes, 9-13days for mass production.
15) Available Service: OEM, 24hrs service for fast prototype.
1. PCB factory price directly;
2. PCB mass production with short lead time;
3. PCB ROHS compliant;
4. PCB ISO9001:2000, UL, ISO14001 Certification;
5. PCB payment T/T, L/C, Western Union;
6. FOB Shenzhen & H.
