Product Description
Quick TR1300A hot air soldering station is an professional intelligent soldering rework station for mobile phone motherboard repair, 1300W Quick TR1300A intelligent hot air soldering station with touch control temperature alarm password lock function multipoint temperature digital calibration for phone PCB soldering repair.
QUICK TR1300A Intelligent Hot Air Station Mobile Phone Soldering Repair. Come with 3pcs: Heat Gun Nozzles 5mm 6mm 8mm, if need 3mm 12mm Nozzle, need bought it alone. More QUICK 861DW TR1300A Nozzles from: VC979.
General Specification:
Power: 1300W
Voltage: 110V 220V for choose
Temperature range: 100 C~500 C 212 F-932 F
Temperature stability: 2 C
Air volume: 6 70L / Min
Airflow: 1 100m3/h
Description :
Host and duct design separately
Ultra-high power 1300W
You can preset the process parameters of the three channels
With temperature alarm function
The use of brushless vortex fan, air flow adjustable, a large range
Can be on the temperature, air volume, time and other parameters set
Mulit-point temperature digital calibration, temperature locked by password.
Parameters of three channels pre-set memory.
Temperature alarm function, C and F interchangeable.
Twin-stag brishless blower pump for stable airflow, long life.
Temperature, airflow, working time and other parameters can be set.
Slient design of the rework station, with noise lower than 55dB.
Plug-in design of ceramic heating element for stable temperature, long life and easy maintenance.
ESD design, ESD testing function.
Can be controlled via PC
QUICK TR1300A 1300W Intelligent Hot Air Soldering Station
Features :
Multipoint temperature digital calibration,Password lock function.
Can preset technological parameter of three gallery, more practical.
Temperature alarm function, temperature changer.
Adopt two-stage supercharging brushless pump, air pressure stability, long life.
Set the parameters such as temperature, air velocity and time.
Ceramic heating element, plug type design.
De-soldering of the SMD components, such as SOIC, CHIP, QFP, PLCC, BGA and so on.
Suitable to hot shrink, drying, remove lacquer and viscosity, thaw, preheating, disinfect and so on.
Suitable to the situation with different grade airflow.
Suitable to the hot air lead free de-soldering.
