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Cvd Diamond Substrates And Wafer

Supplier From China
Oct-25-21

CVD Diamond has been recognized an ideal material for various applications because of its outstanding properties which includes extreme hardness and strength, high thermal conductivity, low thermal expansion, excellent dielectric properties, resistance to chemical attack, and optical transmission over a wide spectral range. It can be widely used in complex tooling and machining processes, thermal-management applications, semiconductor industry and microwave engineering.

Microwave-Transparent Windows and Optics
We supply high-quality diamond optical products that are transparent in the microwave region with a wide range of size and thickness. With our cutting-edge laser technologies, we can customize the optical windows in any shape and dimension according to clients requirement.

Specifications:
Diameter of 65mm (F150mm on request)
Double side surface roughness: Ra 10nm
Flatness: 4um/cm
With higher transparency
Thickness less than 0.5mm
Can be laser cut to any size and shapes

Price and Minimum Quantity

Price: $100 - $150
MOQ: Not Specified

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$350 - $2.50K / Piece (CIF)
MOQ: 10  Pieces
Sample Available
Supplier From South Hackensack, New Jersey, United States
 
SILICON WAFERS are the building blocks of modern technology, they provide the substrate onto which circuits are constructed. We offer Prime, Test, Monitor, SEMI standard, and customized silicon wafers in all diameters from 2�¢?�³ to 300mm. Our Wafers meet the SEMI standards, along with customized options.

Silicon On Insulator (SOI) Wafers: Chips fabricated on SOI wafers achieve 30% faster speeds and 80% lower power demands compared to CMOS devices. The SOI structure consists of three layers: a top active device layer for transistor fabrication, a buried oxide (BOX) insulator layer, and a bottom handle wafer layer.
Silicon Float Zone Wafers: is a crystal growth technique that produces highly pure silicon wafers with fewer impurities than traditional methods.
Silicon Thermal Oxide Wafers: Has high quality silicon thermal oxide wafers in all diameters from 2�¢?�³ to 300mm.
Silicon Nitride Wafers: Has different option of film processing for your silicon needs, including LPCVD nitride.
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Fused Silica Wafers: is the amorphous phase of quartz (SiO2).
Borofloat 33 Glass Wafers: is used in a wide range of applications like micro-optics, sensors, microlithography, semiconductor engineering, lighting, medical technology.
Oct-24-18
 
MF: Si

Chemical Name: Silicon Nanowires
Purity: > 99.9%

Diameter: 40-50 nm

Length: 80 µm

Form Nanowires

Product Number:

CAS Number 7440-21-3
Jun-27-19

High Efficiency Silicon Wafers

$0.20 - $0.50
MOQ: Not Specified
 
Advantage of
156x156mm 200um High efficiency silicon wafers
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3
minority carrier:>2
Hem width:157.00~157.25mm
Thickness:200±20μm
Transfer efficiency:>18.8%
Jun-19-19
 
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156x156mm 200um High efficiency silicon wafers
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Name: High efficiency polysilicon wafer

Technology : Diamond wire cutting
Type : P type
Resistance:1~3s
minority carrier:>2 s
Hem width:157.00~157.25mm
Thickness:200±20m
Transfer efficiency:>18.8%
Jun-27-19

Hot Sales A Grade Polysilicon Wafer

$0.20 - $0.50
MOQ: Not Specified
 
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3
minority carrier:>2
Hem width:157.00~157.25mm
Thickness:200±20 m
Transfer efficiency:>18.8%
Advantage of
top quality factory price 156x156mm 200um high quality Hot Sales A Grade polysilicon wafer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Jun-19-19

156X156Mm 200Um Polysilicon Wafer

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The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
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minority carrier:>2 s
Hem width:157.00~157.25mm
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Solar Silicon Wafers

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top quality factory price 156x156mm 200um high quality High efficiency solar silicon wafers
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The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Name: High efficiency polysilicon wafer

Technology : Diamond wire cutting
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Resistance:1~3s
minority carrier:>2 s
Hem width:157.00~157.25mm
Thickness:200±20m
Transfer efficiency:>18.8%
Jun-19-19

Hot Sales A Grade Solar Wafer

$0.20 - $0.50
MOQ: Not Specified
 
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Hot Sales A Grade polysilicon wafer
The production process is simple, cost-effective, and reduces silicon waste
High conversion efficiency, low fragmentation rate and low optical attenuation
Manufacturing Specialization, Intelligence and Greening
Customized products to meet customer needs
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3s
minority carrier:>2 s
Hem width:157.00~157.25mm
Thickness:200±20m
Transfer efficiency:>18.8%
http://en.hengxingchinese.com/
Hengxing company website: https://hengxingsteelwire.com/
Email contact US:wmsale@hxkjgf.com
Jun-19-19
 
Name: High efficiency
polycrystalline silicon block
Technology :Semi-melting
Type: P Type
Resistance:1~3©cm
minority carrier :>6s
Hem width:157.00~157.25mm
Angle of Chamfer:1~2mm
Name: High efficiency polysilicon wafer
Technology : Diamond wire cutting
Type : P type
Resistance:1~3s
minority carrier:>2 s
Hem width:157.00~157.25mm
Thickness:200±20m
Transfer efficiency:>18.8%

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