Base material: Aluminum/Copper/Iron Alloy
Thermal Conductivity (dielectrial layer): 0.8, 1.5, 2.0, 3.0 W/m.K.
Board Thickness: 0.5mm~3.0mm(0.02"~0.12")
Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, 4.0 OZ, 5.0 OZ
Outline: Routing, punching, V-Cut
Soldermask: White/Black/Blue/Green/Red Oil
Legend/Silkscreen Color: Black/White
Surface finishing: Immersion Gold, HASL, OSP
Max Panel size: 600*500mm(23.62"*19.68")
Packing: Vacuum/Plastic bag
Samples L/T: 10~15 Days
MP L/T: 12~15 Days
