Main Material: FR-4, High TG135TG155,TG170, Aluminum Base, High Frequency CCL Brand: Shenyi, KB, ITEQ, ISOLA, NANYA,ROGERS Layers: 1-12L Mass Production: 1-8 Layers Surface Finish: LF HAL, HAL, Immersion Gold/Tin/Silver Technology: Gold Finger, PeenLble, Carbon Ink ,Impedance Control BGA,HDI Min Hole Size: 8 MIL 0.20mm Min Line Width: 3 MIL(0.076MM) Min Line Spacing: 3 MIL(0.076MM) Outline: CNC Routing, Punching, V-Cut
Take code from mcu mega644pa . We are a company do chip decryption. We mainly work on ic reverse analysis such as micro controller decryption, chip crack, mcu attack, dsp reverse. The chip decryption department professionally handles the work of micro controller reverse, chip decryption, gal logic circuit crack, â cpld crack, recovery of microcode.And we can do pcb oem, your broad can be copy with my engineer technology. If you have any need, please contact us. Part of models: At91sam7x512 at91sam7xc256 at91sam7s64c at91sam7se256 At91sam7s32 at91sam7s321 at91sam7s64 at91sam7s64b At90usb646, at90usb647, at90usb82 At91sam7s64c at91sam7xc512 at91sam7x512 at91sam7xc128 Attiny12 attiny12l attiny12v attiny15 attiny88 At90s1200 at90s2313 at90can128 at90can64 At91sam7s32 at91sam7x512 at91sam7s161 Mega48, mega48a, mega48p, mega48pa mega644, mega644a, mega644p, mega644pa
Kindly introduce that we're a professional manufacturer of high-density & high-frequency, high-frequency compositemetal matrix, rigid-flexible pcb, hdi, etc. High-tech double sides multilayer pcb, especially full with competitive power in special high-frequency and high-frequency composite pcb, our products are widely used in communication, medical, industry, computer, energy, etc high-tech areas. Would you please give both of us a chance if there's any requirement in your side? we will be very pleased to support you to expand the market in your side! Looking forward to hearing from you soon!
1.Quick turn around, prototypes, volumes 2. 1-36 layers 3. Rigid standard boards, flex- and rigid-flex design 4. Fr-4, cem1, teflon, halogenfree, arlon, metal base, high tg 5. Hdi technology 6. Blind and burried vias 7. Micro via 8. 4 mil structure 9. Surfaces: hal, immersion tin, -silver, -gold, hal leadfree, osp 10. Filled-up vias 11. Impedance controlled boards 12. Manual pcb assembling and smt mounting 13. Qfp, cob, bga etc. 14. Ul, iso, sgs, rohs
GESP technology (Dalian) Co.,Ltd. offers Printed Circuit Board manufacturing, providing consistent high quality and affordable price of Printed Circuit Boards. Utilizes cutting edge technology to ensure that all of our products are produced with absolute precision and built to our customers required specifications. We take great pride in offering the most up-to-date facilities and equipment guaranteeing that our products are built fast, efficiently and defect free.
Layer: 1~22 layers Materials: FR-4, CEM-3, Teflon, Aluminum, Rogers, High Tg Surface finished:Lead Free HASL,Immersion Gold/Tin/Silver, OSP, Gold Finger Plating, Selective Immersion Gold,Gold Plating Max.Panel Size: 550 * 650mm Min. Finished Holes Size: 0.10mm Microvias diameter: 0.10 - 0.15mm Min. Line Width/Spacing: 0.075 / 0.075mm Copper Feature to Holes(Outer): Â±0.075mm Min. Plated Drills to Copper(inner): 0.25mm Min. Copper to Edge distance: 0.25mm Max. Copper Thickness: 140m Max. Board Thickness: 4.80 mm Min. Board Thickness: 0.20mm Min. Core Thickness: 0.10mm Min. Soldermask Dam: 0.10mm
2 layer pcb Material: fr4 tg130; Finished thickness :1.6 mm; Copper thickness : 3oz finished ; Surface finishing: gold plating , au 2 u".Min Min via hole size :0.5mm; Min trace width/ spacing : 0.3 mm / 0.3 mm
• Place of Origin: Guangdong, China (Mainland) • Brand Name: ShanXu • Model Number: PCB RoHS Compliant • Number of Layers: 1-30 layer • Base Material: FR4, High Tg FR4, Halogen Free, SYL, Rogers, Aluminium • Copper Thickness: 1/3oz ~ 6oz • Board Thickness: 0.2mm ~ 7.0mm • Min. Line Width/space: 3mil/3mil • Min. Hole Size: 0.2MM • Surface Finishing: Immersion Gold/Au, HASL,LF HASL, OSP, Immersion silver, etc. • Impedance control: ±10% • Solder mask:green/black/white/red/blue/yellow,etc • Silkscreen: White, Black, Yellow, Blue • Hole tolerance: PTH:±0.075,NTPH:±0.05 • PCB Standard: IPC-A-610 E Class II-III • profiling punching: Routing, V-CUT, Beveling • Wrap and twist: 5%
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Layer count: 10L Laminate: IT180, Tg180¡æ Board thickness: 1.60mm Board size: 85.00mm X 146.50mm Line W/S: 3.5mil / 3.5mil Min hole: 0.25mm Impedance control: 50+/-10% Surface finish: ENIG
Layer count: 16L Laminate: FR4, S1170 Board thickness: 2.95mm Board size: 129.50mm X 151.50mm Line W/S: 4mil / 4mil Min hole: 0.20mm Impedance control: 50+/-10% Surface finish: Immersion Silver