Name: High efficiency polycrystalline silicon block Technology :Semi-melting Type: P Type Resistance:1~3©cm minority carrier :>6s Hem width:157.00~157.25mm Angle of Chamfer:1~2mm Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8%
Name: High efficiency polycrystalline silicon block Technology :Semi-melting Type: P Type Resistance:1~3©cm minority carrier :>6s Hem width:157.00~157.25mm Angle of Chamfer:1~2mm Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8%
Advantage of High efficiency P Type solar silicon wafers The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs There are 12 sets of WuXi ShangJi brand diamond wire slicing machines, 8 sets reforming machines, the single blade capacity is 20,000 pieces per day, and the annual production capacity is over 10 million pieces.
Advantage of Hot Sales A Grade solar silicon wafers The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs There are 12 sets of WuXi ShangJi brand diamond wire slicing machines, 8 sets reforming machines, the single blade capacity is 20,000 pieces per day, and the annual production capacity is over 10 million pieces.
Advantage of Hot Sales A Grade polysilicon wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8% http://en.hengxingchinese.com/ Hengxing company website: https://hengxingsteelwire.com/ Email contact US:wmsale@hxkjgf.com
Advantage of 156x156mm 200um High efficiency silicon wafers The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8%
top quality factory price 156x156mm 200um high quality High efficiency solar silicon wafers Manufacturer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8%
Technology : Diamond wire cutting Type : P type Resistance:1~3s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8% Advantage of high quality Hot Sales A Grade polysilicon wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs
Advantage of high quality P Type Polycrystalline Solar Wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Technology : Diamond wire cutting Type : P type Resistance:1~3 s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20 m Transfer efficiency:>18.8%
Advantage of High efficiency P Type polysilicon wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Technology : Diamond wire cutting Type : P type Resistance:1~3s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8%
Advantage of Hot Sales A Grade polysilicon wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Technology : Diamond wire cutting Type : P type Resistance:1~3s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8%
Technology : Diamond wire cutting Type : P type Resistance:1~3μs minority carrier:>2 μs Hem width:157.00~157.25mm Thickness:200±20μm Transfer efficiency:>18.8% Hengxing science and techology co.,ltd built in 1995, with 24 years of steel wire transforming and coating industries, our main product as galavanized steel wire, strand, PC steel wire strand, steel cord radial tire, hyrolic hose and polycrystaline silicon. Listed on Shenzhen A stock market in 2007,we have independent R&D center, passed the ISO, SGS,BV certification and so on. As the biggest galavanized steel wire and srand manufacture in China, and the biggest steel cord for radial tire, with high quality and performance, our product widely used in the industries as electric cable, suspension construction, radial tire and hydrolic hose, and sawing.
Advantage of P Type Polycrystalline Solar Wafer Manufacturer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Technology : Diamond wire cutting Type : P type Resistance:1~3 s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8%
CVD Diamond has been recognized an ideal material for various applications because of its outstanding properties which includes extreme hardness and strength, high thermal conductivity, low thermal expansion, excellent dielectric properties, resistance to chemical attack, and optical transmission over a wide spectral range. It can be widely used in complex tooling and machining processes, thermal-management applications, semiconductor industry and microwave engineering. Microwave-Transparent Windows and Optics We supply high-quality diamond optical products that are transparent in the microwave region with a wide range of size and thickness. With our cutting-edge laser technologies, we can customize the optical windows in any shape and dimension according to clients requirement. Specifications: Diameter of 65mm (F150mm on request) Double side surface roughness: Ra 10nm Flatness: 4um/cm With higher transparency Thickness less than 0.5mm Can be laser cut to any size and shapes
MF: Si Chemical Name: Silicon Nanowires Purity: > 99.9% Diameter: 40-50 nm Length: 80 µm Form Nanowires Product Number: CAS Number 7440-21-3
MF: SiC Chemical Name: Silicon carbide Purity: â?¥ 99.99% APS: 10 nm (Size Customization possible) Form Nano powder CAS Number 409-21-2
The premier manufacturer and supplier in Mena region. The first ever produced batch was grade 52X. Currently we are producing 553, 441, 421 grades and is capable of producing higher grades per order. Silicon powder with purity of 99.9%+. Production capacity 2-3 tons per month
Semiconductor grade silicon wafers with diameter 2" up to 6". One side or double side polished. Boron, Phosphorus, Antimony and Arsenic doped
Silicon ingots, silicon wafers.
Silicon wafer, silicon ingot.
