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Rigid Board

Supplier From China
Oct-18-12

Fr4, high tg, all kind of surface finish, enig, immersion tin, LF HAL, ROHS.


25panel one pack


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More Items Similiar to: Rigid Board

Dec-16-08
 
Rigid PCB Specifications:
Basis Material: FR4 / Tg170
Board Thickness: 1.6 mm
Layer Count: 1-18 layers
Surface Finish: Immersion Tin Immersion Gold / HASL
Finished outer Cu: 2 OZ
Finished inner Cu: 2OZ
Solder resist colour: Green
Ident colour: White
Special: BGA / Gold Finger
Dec-18-14
Supplier From Shenzhen, Guangdong, China
 
Material: fr-4+pi
Layer count£º6 layer
Board thickness:1.60mm
Min line/space: outer layers:0.09/0.09mm
Inner layers: 0.075/0.075mm
Jul-20-20
Supplier From Shenzhen, Guangdong, China
 
IPC Releases 5 New Standards for Flexible/Rigid-Flexible Printed Boards and Performance of Rigid Printed Boards

IPC announces the release of five newly revised standards covering several areas of the supply chain.

IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness PCB Assemblies

IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-2591-Version 1.1, Connected Factory Exchange (CFX)

IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements

IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards

PURCHASE NOW



Details on some of the changes for the newly released standards:



IPC/WHMA-A-620D provides several changes that were requested by the industry. The task group addressed the target conditions in the document by moving some conditions to acceptable criteria while other cases were moved to training.



There are several new or revised graphics

The solderless wrap section was completely revised

A new section was added for over-molding of flexible flat ribbon

IPC-2223E establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures.



Several figures are updated

New sections and comments on microvia stacking

Back-drilled holes and dual row zero insertion force (ZIF) connectors updated

IPC-6012E establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards.



Provides new acceptance criteria for back drilled holes

Establishes new requirements for copper wrap plating of holes in new designs

Discusses reliability issues for microvia structures in class 3 products

IPC-2591 V1.1 establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing.



provides changes made to message sections, and message structure sections

Appendix A was added with a short description of all changes from V1.0

Appendix B provides acronyms and abbreviations

IPC-1791A provides minimum requirements, policies and procedures for printed board design, fabrication and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products.



New Appendix D covering requirements for trust certification of non-U.S. electronic design, fabrication and assembly organizations

Several sections have been updated from Scope through and including 3.0requirements

Classifications of Class I, 2 and 3 have been added
Jul-27-13
Supplier From Changsha, Hunan, China
 
Multilayer pcbs
Major material: fr-4, nelco, htg>170, high cti value, halogen free
Minimum board thickness:
Double sided: 0.2mm
Multilayer: 0.4mm
Maximum board thickness:
Double sided: 2.4mm
Multilayer: 3.2mm
Surface finishing:
Hal
Lead-free hal
Flash gold
Selective gold
Immersion gold (enig)
Immersion tin
Immersion silver
Carbon print
Gold fingers
Entek (osp)
Flux coating
Peelable mask
Gold plating (hard gold)
Enig thick gold
Solder mask plugged hole
Copper finished thickness:
1/2 oz to 6 oz
Minimum hole size: 0.25mm
Minimum line width/spacing: 0.1
Standard: rohs, sgs, ukas, iso14001, dnv, ul

We have:
Advanced equipment
Reliable quality
Reasonable price
High output
Quick delivery
Unlimited ordering quantity



Packing: vacuum packing
Oct-13-20
Supplier From Shenzhen, Guangdong, China
 
Konrich Technologies has been providing printed circuit boards (pcb) to our customers throughout the world for many years.

With our rich experience in pcb manufacturing, we received a high recognition from customers. Good quality record, high on-time delivery rate and excellent customer service leaves a very good impression to our customers and also make us very competitive in the industry.

With the advantage of our strong R&D, we can produce many types of pcb boards - normal single, double to multilayer boards, HDI as well Flex & Rigid-flex boards. Our pcb boards are widely used in many fields - Industrial control, Communication, Medical, Security, Consumer Electronics, etc.
Jul-19-22
Supplier From Ansan-si, Gyeonggi-do, South Korea (Republic Of Korea)
 
1. LAYER : 4 layer [FLEXIBLE 1 layer + RIGID 3 layer] 4-1
2. Application : Industrial Equipment
3. Thickness : 0.5T
4. Machine Drill : Min. 0.25 mm
5. Laser Drill : BVH Min. 0.12 mm
6. Cu Plating : HOLE Min. 25 micrometer
7. L/S : 110 micrometer/ 120 micrometer
Apr-18-20
 
Rigid Flex Printed Circuit Boards:
Layers : 4 Layer
PCB Material: FR4 High Tg and polyimide
Board Thickness: 1.6mm
Surface Finishing: ENIG
Finished Copper thickness: 1/1/1/1 OZ

Special Process:

Rigid-Flex PCB
Rigid-Flex PCB Capability:

Minimum Circuit Trace Width/Space: 2.7/2.7mil
The Minimum Via Size : 0.15mm
The Minimum legend Height/Width: 0.5mm/0.12mm
Surface Finishing: HASL-LF, ENIG,ENEPIG,OSP,Gold Finger,Hard Gold Plating,Immersion Silver,Immersion Tin
Special Technology: Blind&buried via, Via In Pad,Backdrill,Small BGA Pad,Impedance control,Heavy Copper,Copper Filled Vias,Countersink hole,Depth Milling
Material Type: FR4,Metal Core,Halogen Free FR4,Rogers,PTFE,Arlon,Nelco,Polyimide
Maximum Panel Dimension: 1200mm x 600mm
Final Board Thickness: 0.4mm ~ 6.0mm
Final Copper Thickness: HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 10OZ
FR4 Substrate Thickness: 0.1mm 0.2mm 0.3mm 0.4mm 0.5mm 0.6mm 0.8mm 1.0mm 1.2mm 1.5mm 2.0mm 2.36mm
Solder Mask Colour: Green White Black Red Blue Yellow
Shaping: CNC Routing,Punching,V-CUT, Depth milling, Castellation
Special Hole: Blind&buried hole,Depth milling,T-slot,Countersink hole
Sep-10-19
Supplier From Shenzhen, Guangdong, China
 
Model : 10L Camera Module Rigid-Flex Board

Material FR4 +PI

Layer Rigid 4L + Flex 2L

Copper Thickness 1OZ

Finished Thickness 0.6mm

Surface Treatment : Immersion Gold

Min Hole :0.21mm

Trace/Space :3mil/3mil
Sep-10-19
Supplier From Shenzhen, Guangdong, China
 
Model : 10L Camera Module Rigid-Flex Board

Material FR4 +PI

Layer Rigid 4L + Flex 2L

Copper Thickness 1OZ

Finished Thickness 0.6mm

Surface Treatment : Immersion Gold

Min Hole :0.21mm

Trace/Space :3mil/3mil

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