RELIFE RL-20A 2.0mm Tin suction solder wire, desoldering mesh braid. This copper soldering wick is for phone motherboard BGA PCB Tin planting/cleaning repair.
Features:
Suitable for cleaning PCB boards and other solders.
Braid design Copper wick with fine braid design to promote strong capillary action to pull in excess solder.
Plain knitting, fast heat conduction, suitable for rapid tin removal, reducing the risk of thermal damage to the circuit board.
With low residue design This solder braid helps clean spare solder on the pin away to avoid short circuit, especially great for small, hard to reach areas.
Pure oxygen free copper wire No clean flux for easy usage. The solder wick can help clean some residue flux and increase the speed of cleaning the PCB pad.
Refined from pure copper and special chemical formula, resistant to oxidation and corrosion, good thermal conductivity and tin absorption.
Widely use can be used to correct mistakes with small boards on PCBs, remove relays and other components from printed circuit boards, resolder mechanical keyboard switches, unsoldering old wire from devices, desoldering computer parts such as a motherboard and so on.
How to use it?
Place the wick over the solder that needs to be removed and then push the heated soldering iron tip onto the wick.
Remove the wick at once when the solder has been absorbed.
Cut off the used part of the wick.
Specifications:
Size: 2.0mm*0.8m
Material: copper wire
Color: bronze
Melting point: 280
Working temperature: 280480
Welding current: 0 (A)
Package list:
1* Soldering Wire
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