We are specializes in the manufacture of a wide range of board types. The emphasis on R&D has helped us become a market leader in the development and manufacturing of advanced PWBs.
Our capabilities enable us to offer:
Rigid boards up to 42 layers
Flex and Rigid-Flex boards up to 40 layers
Hybrid solutions for Microwave/RF applications
Thermal and signal integrity management solutions, employing coins and cavities
2D or 3D heat-sinks: Copper and Aluminum
Carbon printing
HDI blind, buried, staggered & stacked vias
Buried passive components: capacitors and resistors
In-house HATS lab
