The UV laser marking machine is developed by using a 355nm UV laser. This machine uses a third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355nm UV laser has a very small spot, and the marking effect is directly interrupted by a short-wavelength laser. The molecular chain greatly reduces the mechanical deformation of the material. Thermal deformation (cold light), because it is mainly used for ultra-fine marking and engraving. It is especially suitable for applications such as marking, micro-hole drilling of food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.
1. Lightweight,energy-saving and maintenance-free Integrated air-cooled structure. Volume only 0.15m�³.
2. 6 preset cleaning processes+ 3 custom ones Corresponding to different usage requirements. Simple operation.
3. Double-wobble Cleaning Head Scanning width up to 190mm.
4. 8 Light Modes Meet various operation requirements.
5. High Power Density and Strong Output.Energy is twice that of ordinary models, effectively addresses issues of difficult cleaning and inefficiency.
INDIUM PHOSPHIDE (InP) WAFERS are semiconductor materials made of indium phosphide, a compound semiconductor that is widely used in high-frequency and optoelectronic applications. Due to its efficient electron mobility and direct bandgap properties, InP is favored for devices such as:
High-speed electronics
Laser diodes
Photodetectors
Telecommunications applications, including optical fiber communication
We offer the following InP Wafers:
Undoped InP Wafers: These are pure InP with no intentional doping, used in various applications where intrinsic properties are required.
N-type InP Wafers: Doped with donor impurities (such as tellurium) to increase electron concentration, useful in transistors and high-speed electronics.
P-type InP Wafers: Doped with acceptor impurities (such as zinc) to create holes in the semiconductor, used in light-emitting devices and other optoelectronics.
InP Substrates: Used as a base for growing other semiconductor materials in heterostructures for various applications.
InP Membrane Wafers: Thin layers of InP used for specific applications, including applications in flexible electronics and advanced photonic devices.
InP-based Quantum Dot Wafers: Engineered to create quantum dots that can be used in photonic and optoelectronic devices for enhanced performance.
Our organization is offering an astonishing range of Laser Cutting Services. Offered array of services is rendered according to quality norms. In addition to this, offered services are much admired due to their hassle free management, on-time execution, and client-focused approach.
Our Laser Cutting-Bending software are qualified to handle any complicated shape with less process time and high accuracy with zero tooling cost with prompt services in low/high (Bulk) Quantities Supply.
We look forward to business association with you for long term. We offer economical rate in volume business tie up
Inside Copper Outside Steel 650 Ml Water Bottle .it Helps To Balance Vata,PITT AND KAFA ,IN REGULATING OBESITY,REDUCE PIGMENTATION OF HAIR AND EYES,IMPROVES YOU SKIN HEALTH AND MELANIN PRODUCTION AND HELPS IN FORMATION OF NEW CELLS,SUGER AND IRON ABSORPTION.STAINLESS STEEL INCREASE THE TOUGHNESS AND COPPER IMPROVES DIGESTION,STRONGER BONES AND GLOWING SKIN.
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Laser Pointer with 25° deflection from straight laser path and able to rotate pointing beam 360° freely more ergonomic for use (no more straight path only)
We hold expertise in offering for MS Profile Cutting Services. We have gained profound expertise in fabricating precisely cut panels, enclosures, and equipments by rendering most competitive profile cutting services. Our established team members are leveraging the latest laser cutting techniques to cut profiles of stainless steel and mild steel material in all kinds of sizes and shapes. Further, we are able to cut profiles in client specific dimensions with assurance of precision engineering and well timed execution.
We are rendering MS Laser Cutting Service. Owing to their stress-free completion and timely completion, our services are immensely admired by our patrons. Our prompt response as well as ethical policies has helped us in earning the trust of our clients. We have experienced professionals, who render this service using modern technology in adherence with the international quality standards.
A whole laser marking head (or called laser scanner) consists of two scan mirrors, two galvanometers (or called galvo-scanner motor) & drive cards, a XY mount, a scanning lens (f-theta lens), an interface card (or called D/A card), a set of marking software and a DC power supply. Two types of scanning optics for CO2 and Nd:YAG lasers are available.
