Product Name: Sodium Hypophosphite
CAS No.: 7681-53-0
Chemical Formula: NaH PO·H-O
Appearance: White crystalline powder
Grade: Industrial / Electronic grade available
--Product Description
Sodium Hypophosphite is a powerful reducing agent mainly used in electroless nickel plating (ENP) and various chemical synthesis processes. It offers strong reducing capacity, thermal stability, and solubility in water, making it ideal for electronics, surface finishing, catalysis, and even flame retardant formulations.
Its high reactivity and purity make it essential for metal surface treatment, especially in non-cyanide plating baths.
-- Key Applications
Electroless Nickel Plating (ENP)
As the primary reducing agent in metal surface finishing; allows uniform nickel deposition without electricity.
Reducing Agent
In pharmaceutical, agrochemical, and fine chemical synthesis.
Flame Retardant
Intermediate in production of phosphinate-based flame retardant additives.
Catalysis / Stabilization
Acts as a catalyst stabilizer in certain polymer and resin systems.
-- Product Advantages
High Reduction Efficiency: Ideal for electroless plating with excellent control.
Water-Soluble & Stable: Easy to handle and compatible with aqueous formulations.
High Purity: Low metal and sulfate content for precise applications.
Reliable Performance in Electronics: Widely used in circuit board and semiconductor finishing.
Versatile Reactivity: Suitable for advanced chemical synthesis processes.
-- Packaging & Storage
25kg plastic-lined woven bags.
500kg or 1000kg jumbo bags available for bulk orders.
Store in a cool, dry, well-ventilated area.
Avoid direct sunlight and moisture.
Shelf life: 12 months in original sealed packaging.
-- Delivery & Handling
Non-hazardous, but avoid moisture and heat during transport.
Custom labeling and OEM services available.
Standard delivery time: 7-10 working days.
