Congratulations on the purchase of your Rxiry XR1800C laser rangefinder, a cost-effective professional rangefinder. This compact and lightweight laser is a flexible tool for your measurement needs. This rangefinder includes eight measurement modes, three target modes, RS232 serial data output and Rxiry measurement APP.
Integrating laser sensor, inclination sensor and compass , it can measure horizontal distance, slope distance, vertical distance, inclination, calculate the 2D and 3D missing line routine and Azimuth
Measurement Mode
VD ML mode
Calculate height difference of 2 points by measuring the distance of them. And the 2 points need be visible and the laser can reach them.
HD ML mode
Calculate the horiz0ntial distance of 2 points in the vertical direction. And the 2 points need be visible and the laser can reach them.
HT mode
Calculate height of 2 points, and first point should be visible and laser can reach it, for example, measure the height of buildings, water tower, high voltage line, electric pole.
HD HT mode
Calculate height of object by 3 points on it when top and bottle of object are invisible, it mean that the point can not be locked by lase, for example, measure the height of tree
HD / SD mode
Measure the horizontal distance and slop distance of target point in same time
VD mode
Measure the vertical distance and inclination of target point
SPD mode
Indicate the speed of moving object
GPS mode
Indicate the location of the rangefinder
The UV laser marking machine is developed by using a 355nm UV laser. This machine uses a third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355nm UV laser has a very small spot, and the marking effect is directly interrupted by a short-wavelength laser. The molecular chain greatly reduces the mechanical deformation of the material. Thermal deformation (cold light), because it is mainly used for ultra-fine marking and engraving. It is especially suitable for applications such as marking, micro-hole drilling of food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.
