Shenzhen Grande Electronic Co., LTD. provides customers with 20 years of leadership and experience in advanced PCB Assembly technology, with proven processes and a full range of services. From prototyping, low volume high mix to high volume global manufacturing, we provide Printed Circuit Board Assembly services in over 40 facilities located in Europe, Asia and the Americas. Grande is a recognized leader, developing the latest PCBA and surface mount (SMT) capabilities including support for : 1, 0201 components, fine pitch and high count BGAs, Package on Package (POP), Chip on Board, fiber optics, RF microelectronics, press fit connectors 2, Hybrid processes (tin-lead and lead-free), pin through hole, wave & selective soldering, double and single sided reflow, wide body and backplanes 3, Quick turn prototype assembly, RoHS compliance certification, conformal & parylene coating, laser marking 4, Inspection and testing using the latest SPI, AOI, Flying probe and X-Ray equipment 5, Comprehensive electrical testing and test system development for boundary scan, in-circuit test (ICT), functional test and burn in test (BIT)
Shenzhen Grande Electronic Co., LTD. provides customers with 20 years of leadership and experience in advanced PCB Assembly technology, with proven processes and a full range of services. From prototyping, low volume high mix to high volume global manufacturing, we provide Printed Circuit Board Assembly services in over 40 facilities located in Europe, Asia and the Americas. Grande is a recognized leader, developing the latest PCBA and surface mount (SMT) capabilities including support for : 1, 0201 components, fine pitch and high count BGAs, Package on Package (POP), Chip on Board, fiber optics, RF microelectronics, press fit connectors 2, Hybrid processes (tin-lead and lead-free), pin through hole, wave & selective soldering, double and single sided reflow, wide body and backplanes 3, Quick turn prototype assembly, RoHS compliance certification, conformal & parylene coating, laser marking 4, Inspection and testing using the latest SPI, AOI, Flying probe and X-Ray equipment 5, Comprehensive electrical testing and test system development for boundary scan, in-circuit test (ICT), functional test and burn in test (BIT)
Material: FR-4 1.6mm 1/1oz Surface finish: HASL Characteristic: 8 counter holes to be counter sink from bottom side; Routing in the center of the board: thickness1.0mm
pcba Application Power supply equipment CHIP Size 0402 QFN Spacing 0.4mm QFN Spacing 0.4mm electronic componet SMT Package Type Tape package, Tay tray package, Pipe package
Model No. JAGUAR N250 Number of heating zones 2 Length of heating zones 600mm Body size 1800(L)*1200(W)*1600(H) Outside dimension 2600(L)*1200(W)*1600(H) Weight 700KG Total/running power 11KW/4-6KW Air supply 0.5MPa Preheating method Hot air Preheating power 220V 5KW Control method Press key +PLC (Option: touch screen, PC) Range of temp. control Room temperature---300â?? Preheating time About 10-15mins for setting 150â?? Solder type Lead-free / Sn-Pb
Jinsung Electronics, founded in 1995, manufactures RF/Flexible PCB, which are the most basic main board of electronic products that are closely related to our daily life. Jinsung Electronics produced flex and rigid-flex printed circuit boards that assisted physicians and healthcare professionals to offer more functions, operational easiness, and smaller size packages through innovation and collaboration with customers.
Supplier: Pcb equipment accessories
Rigid-Flex PCB for Medical equipment
1. Aluminum core, 125*73mm=1PCB 2. Double sided 3. Thermal conductivity: 2.0W/MK 4. Green solder mask/ white text 5. 2 OZ copper finished 6. 2.4mm finished thickness 7. Immersion Gold 8. Plated through hole (PTH) 9. layer stack up ------solder mask ------copper 70¦Ìm (layer 1) ------dielectric thick 75¦Ìm ------aluminum core 2.0mm ------dielectric thick 75¦Ìm ------copper 70¦Ìm (layer 2) ------solder mask
