Solvent Based PU Adhesive - Two Component Our Solvent Base grades are food grade ( US FDA ) is suitable for manufacturing flexible packaging materials for General to medium performance Applications like snack food , spices, condiment, other food items ( non aggressive jobs ) and detergent , shampoo , soaps , other personal care items ( aggressive jobs ) as well as high performance end uses like retort, pharmaceutical applications (including cold forming), various electrical insulation material etc. It is well suited for hot fill and retort applications as well as packing aggressive goods like liquids, aggressive filling goods etc.
HVAC insulation adhesive
Solvent less PU Adhesive - Two Component Our Solvent less grades are Food Grade ( US FDA ) suitable for manufacturing flexible packaging materials for snack foods and can also be used for high performance applications like shampoos, soaps, and other such personal care items and also used in liquor, hot fill and heavy bags.
suitable for Pressure Sensitive coating application in BOPP Packaging Tapes, Holographic labels and other allied uses.
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most printed and unprinted substrates including polyester, polyethylene, polypropylene, nylon, aluminum foil, and metalized substrates
TSF Granule Hotmelt Adhesive: Used in adhesive applications requiring pressure sensitivity. It is ideal for labels, tapes, and other adhesive products requiring clean and easy application.
Side/ Flap pasting Adhesives This grade is suitable for side flap sealing of mono-cartons in high speed machines like Bobst, Eureka, Yoko type of machines for bonding of laminated, UV Varnished and non -varnished surfaces etc. Also can be used for paper bag side & bottom pasting. Advantages : 1. The product is smooth flowing with good machine running characteristics. 2. Suitable for nozzle and cylinder application in high speed sealing machine. 3. Fast setting characteristics, gives undisturbed setting. 4. Retains paper tear of bond at -5°C & 70°C.
Hotmelt Adhesives for Shoe Industry We are dealing in different types of hot melt adhesives (SBC, EVA, APO-based HMAs, Polyesters, Polyamides and PUR) are used for bonding specific shoe components.
