Single Side : Maximum shipping Panel Size 470mm*570mm Finished Board Thickness : Minimum Board Thickness : 0.6mm+/-0.1mm , Maximum Board Thickness : 2.0mm+/-10% Dielectric Material : Heat Conductive Glue / FR4 Aluminum Type : 5052 Copper Thickness : 1/2~2oz Trace Width / Spacing : Minimum Line Width / Spacing(Internal&External) 0.1mm ,The tolerance followed by IPC-6012 Surface Finish : Immersion Gold(Ni/Ru) 0.025~0.1um /Lead Free HASL (Min. 2.5um)/OSP (Entek CU106A) 0.2~0.5um Solder Mask : LPI Test : Hi-Pot Test
Layers: FPC 1~4 L Finished Board Thickness with Copper : Min 0.075mm (1L) / Max 0.3mm (2L) Finished Board Thickness Tolerance: �±0.02~0.04mm Impedance Control :+/-10% Base Copper Thickness : Standard : 1/3oz,1/2oz,1oz / Spcial:2oz Base Film Thickness:Standard:0.5mil , 1mil / Special : 2mil Stiffener:PI / FR-4 /SUS Finished Hole Diameter:Min { }0.15mm / Max { }6.30mm Finished Hole Diameter Tolerance PTH�±3mil(�±0.075mm) npth�±2mil(�±0.05mm)
Layers : Sample 1~32 / Mass Production 1~20 Size :Max shipping size is 600mmx550mm , +/-0.15mm Finished Board Thickness: Min 0.4mm(4L)/0.6mm(6L),+/-0.1mm (Max) 3.6mm(2.2~3.6mm depends on material), +/-10% Copper Thickness :1/3~5oz (Depends on material) Impedance Control :+/-10% Via Holes (Min) : Mechanical Drill:0.2mm / Micro Via:0.1mm PTH+/-0.075mm NPTH +/-0.05mm Aspect Ratio : Sample :10:1 / Mass Production :8:1 Min Trace(Width/Spacing) : Internal 0.075mm / External 0.075mm The tolerance followed by IPC-6012 Advance Process : Blind Routing Cavity,Coil Board,Plug Hole With Epoxy,Half Hole Plated Spacing between Pads : Min :8 mil
We just processed in a large batch of chipsets. I posted below current inventory and attached pictures of each type of chipset. Please review and let me know your interest/offer. Chipset 1 (H61) â?? 3,350 units Chipset 2 (H81) â?? 2,206 units Chipset 3 (H55) â?? 436 units Chipset 4 (B250) â?? 1,600 units Chipset 5 (SR406) â?? 345 units Thank you, Divanti Group
Brand Name: strongtimes Number of Layers: 4 Base Material: FR-4 Copper Thickness: 3mil Board Thickness: 1.6mm Min. Hole Size: 4mil Min. Line Width: 3mil Min. Line Spacing: 3mil Surface Finishing: lead free hal Printed Circuit board, Single Side PCB, Double Side PCB, Multilayer PCB, Rigid Flexible PCB, Rigid PCB, Flexible PCB, Impedance PCB, HDI PCB, MCPCB, FPC, Aluminum PCB, PCB, PCBA StrongTimes Electronics Co., Ltd is a high and new technological company which specializing in manufacturing single-sided, double-sided and multilayer PCB of high precision, high density and high reliability.
General specification for hdi pcb Layer count: 4-20layers Type of stack up: 1+n+1, 2+n+2 Material available: fr4, high tg fr4, halogen free fr4 Board thickness: 0.4-3.2mm Finished copper thickness: 1/3oz ¡§c 3oz Min trace width/spacing: 3/3mil Min through hole: 0.2mm Min blind via: 0.1mm Surface treatment: immersion gold, enig + osp Vacuum package
Material: fr4 Setup: 3 + 4 + 3 Finishing thickness: 1.0 ¡¨¤0.1mm Minimum width/spacing: 0.10/0.10mm Minimum laser via: 0.1mm Surface finishing: enig + osp Specialty: blind and buried via Application field: communication
Multilayer and 2rd HDI PCB 35