Irrigation products.
Irrigation systems products.
High efficiency irrigation system products, accessories and fittings.
Drip irrigation tape, pipe making machines.
Irrigation sprinklers, filters, air vents, micro sprinklers.
Gardening irrigation product, water timer, garden spray nozzle, coil hose, connector.
Agricultural machinery, sprinkler, drip irrigation system, filter system.
Drip and sprinkler irrigation pipes and couplings.
Drip irrigation system, sprinklers, micro irrigation systems, irrigation pipes and plastic items under chapter 39.
Inline flat dripper irrigation tape, inline round dripper irrigation pipe, labyrinth drip tape.
Inline emitters, inline emitter drip pipe, labyrinth drip tape, drip pipe line.
Pe coex greenhouse cover, dtretch film, solarization film, mulch film, bags, irrigation pipes.
HDPE pipes and sprinkler irrigation systems.
Drip irrigation plastic and metal filters.OEM
Drip irrigation machine.
Agricultural drip irrigation products.
Irrigation fittings, control valves (GG25, GGG40, plastic), air valves (single, double, triple), couplings, locked couplings, filters and controllers, all kind pvc pipe fittings.
Drip tape with flat dripper, drip pipe with cylindrical dripper, PE pipe, PE tubing for farmland irrigation, drip belt with single wing labyrinth.
Center pivot irrigation system, lateral move irrigation system, hose reel irrigation system.
The UV laser marking machine is developed by using a 355nm UV laser. This machine uses a third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355nm UV laser has a very small spot, and the marking effect is directly interrupted by a short-wavelength laser. The molecular chain greatly reduces the mechanical deformation of the material. Thermal deformation (cold light), because it is mainly used for ultra-fine marking and engraving. It is especially suitable for applications such as marking, micro-hole drilling of food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.
